AMD Radeon Pro WX 4150 vs Intel Arc A770 16GB Full Specs

Summary

896 Shaders 1.05GHz	4,096 Shaders 2.4GHz
4GB GDDR596GB/s	16GB GDDR6560.1GB/s
Peak·FP32·FP16 1.89 TFLOPS	Peak·FP32·FP16 19.66 TFLOPS
Form Factor Soldered	Form Factor PCIe Card
TDP 50W	TDP 225W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Radeon Pro WX 41501.89 TFLOPSFP16

x1

Arc A770 16GB629.1 TOPSINT4 Tensor

x333.41

Show Top Score

Theoretical Performance

Clock Speed1053MHz UC·Base·Boost·OC	Clock Speed2400MHz UC·Base·Boost·OC
Peak OPS 1.89 TFLOPSFP16	Peak OPS 629.1 TOPSINT4 Tensor
-	Tensor FP16-32 157.3 TFLOPS
-	Tensor BF16 157.3 TFLOPS
FP32 1.89 TFLOPS	FP32 19.66 TFLOPS
FP64 117.9 GFLOPS	FP64 4.92 TFLOPS
Tensor INT4 -	Tensor INT4 629.1 TOPS
-	Tensor INT8 314.6 TOPS
Pixel Rate 16.9 GPixel/s	Pixel Rate 307.2 GPixel/s
Texture Rate 59 GTexel/s	Texture Rate 614.4 GTexel/s

Core Config

Shaders 896 Shaders	Shaders 4,096 Shaders
TMUs 56 TMUs	TMUs 256 TMUs
ROPs 16 ROPs	ROPs 128 ROPs
Tensor Cores -	Tensor Cores 512 T-Cores
RT Cores -	RT Cores 32 RT-Cores
CUs 14 CUs	EUs 512 EUs

Clocks

Base Clock 1GHz	Base Clock 2.1GHz
Boost Clock 1.05GHz	Boost Clock 2.4GHz

Cache

L2 Cache 1MB shared

L2 Cache 8.2MB shared

Memory

4GB GDDR5	16GB GDDR6
Memory Bus 128-bit	Memory Bus 256-bit
Memory Speed 6GT/s	Memory Speed 17.5GT/s
Memory Bandwidth 96GB/s	Memory Bandwidth 560.1GB/s

Power & Thermals

TDP 50W

TDP 225W

Video Output

Multi-Monitor 3	Multi-Monitor 4
HDCP HDCP 2.2	HDCP -

Ports

-	3x DisplayPort 2.0
-	1x HDMI 2.1

Encoder

Encoder Model VCE 3.4

Encoder Model Arc

Decoder

Decoder Model UVD 6.3

Decoder Model Arc

Card

Form Factor Soldered	Form Factor PCIe Card
PCIe -	PCIe 2-Slots
-	Height 98.4 mm (3.87") Width 279.9 mm (11.02") Depth 40 mm (1.57")
Cooling Open-Air -	Cooling Open-Air 2x Fans

Chip

Manufacturer AMD	Manufacturer Intel
Chip Designer AMD	Chip Designer Intel
Architecture GCN 4	Architecture Alchemist
Family Radeon Pro WX	Family Arc A
Branding	Branding
Codename Baffin	Codename Xe HPG
Chip Variant Polaris 11 XL	Chip Variant DG2-512
Market Segment Laptop	Market Segment Desktop
Release Date Mar 1, 2017	Release Date Oct 14, 2022

Fabrication

Foundry GlobalFoundries	Foundry TSMC
Fabrication Node 14LPP	Fabrication Node N6
Die Size 123mm²	Die Size 406mm²
Transistor Count 3 Billion	Transistor Count 21.7 Billion
Transistor Density 24.39 MTr/mm²	Transistor Density 53.45 MTr/mm²

Images

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Competitors

AMDRadeon Pro WX 4150 vs GPU NVIDIAGeForce RTX 5050 Laptop 50W AMDRadeon Pro WX 4150 vs GPU NVIDIAGeForce RTX 5050 Laptop 80W AMDRadeon Pro WX 4150 vs GPU NVIDIAGeForce RTX 5050 Laptop 100W Show 12 more

IntelArc A770 16GB vs GPU AMDRadeon RX 9070 IntelArc A770 16GB vs GPU NVIDIAGeForce RTX 5070 IntelArc A770 16GB vs GPU AMDRadeon RX 9070 XT Show 12 more