GPUs

AMD Radeon Pro WX 4170 vs Intel Arc A770M Full Specs

1,024 Shaders
1.2GHz
4,096 Shaders
1.65GHz
4GB GDDR596GB/s
16GB GDDR6512GB/s
··
2.46 TFLOPS
··
13.52 TFLOPS
Form Factor
Soldered
Form Factor
Soldered
TDP
60W
TDP
120W

Radeon Pro WX 4170Radeon Pro WX 41702.46 TFLOPSFP16
x1
Arc A770MArc A770M432.5 TOPSINT4 Tensor
x175.85

Clock Speed
···
Clock Speed
···
Peak OPS
2.46 TFLOPSFP16
Peak OPS
432.5 TOPSINT4 Tensor
-
Tensor FP16-32
108.1 TFLOPS
-
Tensor BF16
108.1 TFLOPS
FP32
2.46 TFLOPS
FP32
13.52 TFLOPS
FP64
153.7 GFLOPS
FP64
3.38 TFLOPS
Tensor INT4
-
Tensor INT4
432.5 TOPS
-
Tensor INT8
216.3 TOPS
Pixel Rate
19.2 GPixel/s
Pixel Rate
211.2 GPixel/s
Texture Rate
76.9 GTexel/s
Texture Rate
422.4 GTexel/s

Shaders
1,024 Shaders
Shaders
4,096 Shaders
TMUs
64 TMUs
TMUs
256 TMUs
ROPs
16 ROPs
ROPs
128 ROPs
Tensor Cores
-
Tensor Cores
512 T-Cores
RT Cores
-
RT Cores
32 RT-Cores
CUs
16 CUs
EUs
512 EUs

Base Clock
1GHz
Base Clock
300MHz
Boost Clock
1.2GHz
Boost Clock
1.65GHz

L2 Cache
1MB shared
L2 Cache
8.2MB shared

4GB GDDR5
16GB GDDR6
Memory Bus
128-bit
Memory Bus
256-bit
Memory Speed
6GT/s
Memory Speed
16GT/s
Memory Bandwidth
96GB/s
Memory Bandwidth
512GB/s

TDP
60W
TDP
120W

Multi-Monitor
3
Multi-Monitor
4
HDCP
HDCP 2.2
HDCP
-

Encoder Model
VCE 3.4
Encoder Model
Arc

Decoder Model
UVD 6.3
Decoder Model
Arc

Form Factor
Soldered
Form Factor
Soldered

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon Pro 2016 branding
Branding
Arc branding
Codename
Baffin
Codename
Xe HPG
Chip Variant
Polaris 11 XL
Chip Variant
DG2-512
Market Segment
Laptop
Market Segment
Laptop
Release Date
Mar 1, 2017
Release Date
Jun 28, 2022

Foundry
GlobalFoundries
Foundry
TSMC
Fabrication Node
14LPP
Fabrication Node
N6
Die Size
123mm²
Die Size
406mm²
Transistor Count
3 Billion
Transistor Count
21.7 Billion
Transistor Density
24.39 MTr/mm²
Transistor Density
53.45 MTr/mm²

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