AMD Radeon Pro WX 7100M vs Intel Arc A770 Full Specs

Summary

2,304 Shaders 1.24GHz	4,096 Shaders 2.4GHz
8GB GDDR5160GB/s	8GB GDDR6512GB/s
Peak·FP32·FP16 5.73 TFLOPS	Peak·FP32·FP16 19.66 TFLOPS
Form Factor Soldered	Form Factor PCIe Card
TDP 130W	TDP 225W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Radeon Pro WX 7100M5.73 TFLOPSFP16

x1

Arc A770629.1 TOPSINT4 Tensor

x109.84

Show Top Score

Theoretical Performance

Clock Speed1243MHz UC·Base·Boost·OC	Clock Speed2400MHz UC·Base·Boost·OC
Peak OPS 5.73 TFLOPSFP16	Peak OPS 629.1 TOPSINT4 Tensor
-	Tensor FP16-32 157.3 TFLOPS
-	Tensor BF16 157.3 TFLOPS
FP32 5.73 TFLOPS	FP32 19.66 TFLOPS
FP64 358 GFLOPS	FP64 4.92 TFLOPS
Tensor INT4 -	Tensor INT4 629.1 TOPS
-	Tensor INT8 314.6 TOPS
Pixel Rate 39.8 GPixel/s	Pixel Rate 307.2 GPixel/s
Texture Rate 179 GTexel/s	Texture Rate 614.4 GTexel/s

Core Config

Shaders 2,304 Shaders	Shaders 4,096 Shaders
TMUs 144 TMUs	TMUs 256 TMUs
ROPs 32 ROPs	ROPs 128 ROPs
Tensor Cores -	Tensor Cores 512 T-Cores
RT Cores -	RT Cores 32 RT-Cores
CUs 36 CUs	EUs 512 EUs

Clocks

Base Clock 1.19GHz	Base Clock 2.1GHz
Boost Clock 1.24GHz	Boost Clock 2.4GHz

Cache

L2 Cache 2MB shared

L2 Cache 8.2MB shared

Memory

8GB GDDR5	8GB GDDR6
Memory Bus 256-bit	Memory Bus 256-bit
Memory Speed 5GT/s	Memory Speed 16GT/s
Memory Bandwidth 160GB/s	Memory Bandwidth 512GB/s

Power & Thermals

TDP 130W

TDP 225W

Video Output

Multi-Monitor 3	Multi-Monitor 4
HDCP HDCP 2.2	HDCP -

Ports

-	3x DisplayPort 2.0
-	1x HDMI 2.1

Encoder

Encoder Model VCE 3.0

Encoder Model Arc

Decoder

Decoder Model UVD 6.3

Decoder Model Arc

Card

Form Factor Soldered	Form Factor PCIe Card
PCIe -	PCIe 2-Slots
-	Height 98.4 mm (3.87") Width 279.9 mm (11.02") Depth 40 mm (1.57")
Cooling Open-Air -	Cooling Open-Air 2x Fans

Chip

Manufacturer AMD	Manufacturer Intel
Chip Designer AMD	Chip Designer Intel
Architecture GCN 4	Architecture Alchemist
Family Radeon Pro WX	Family Arc A
Branding	Branding
Codename Ellesmere	Codename Xe HPG
Chip Variant Polaris 10 XL	Chip Variant DG2-512
Market Segment Laptop	Market Segment Desktop
Release Date Mar 1, 2017	Release Date Oct 14, 2022

Fabrication

Foundry GlobalFoundries	Foundry TSMC
Fabrication Node 14LPP	Fabrication Node N6
Die Size 232mm²	Die Size 406mm²
Transistor Count 5.7 Billion	Transistor Count 21.7 Billion
Transistor Density 24.57 MTr/mm²	Transistor Density 53.45 MTr/mm²

Images

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Competitors

AMDRadeon Pro WX 7100M vs GPU NVIDIAGeForce RTX 5050 Laptop 50W AMDRadeon Pro WX 7100M vs GPU NVIDIAGeForce RTX 5050 Laptop 80W AMDRadeon Pro WX 7100M vs GPU NVIDIAGeForce RTX 5050 Laptop 100W Show 12 more

IntelArc A770 vs GPU NVIDIAGeForce RTX 5070 IntelArc A770 vs GPU AMDRadeon RX 9070 IntelArc A770 vs GPU AMDRadeon RX 7650 GRE Show 12 more