GPUs

AMD Radeon R5 6CU 758MHz GCN 3 vs Intel Graphics 2C 2300MHz Full Specs

384 Shaders
758MHz
256 Shaders
2.3GHz
Shared Memory29.9GB/sDDR3
Shared Memory119.5GB/s
·
··
582.1 GFLOPS
··
1.18 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Radeon R5 6CU 758MHz GCN 3Radeon R5 6CU 758MHz GCN 3582.1 GFLOPSFP16
x1
Graphics 2C 2300MHzGraphics 2C 2300MHz37.68 TOPSINT4 Tensor
x64.73

Clock Speed
··
Clock Speed
··
Peak OPS
582.1 GFLOPSFP16
Peak OPS
37.68 TOPSINT4 Tensor
-
Tensor FP16-32
9.42 TFLOPS
-
Tensor BF16
9.42 TFLOPS
FP32
582.1 GFLOPS
FP32
1.18 TFLOPS
FP64
36.38 GFLOPS
FP64
294.4 GFLOPS
Tensor INT4
-
Tensor INT4
37.68 TOPS
-
Tensor INT8
18.84 TOPS
Pixel Rate
6.1 GPixel/s
Pixel Rate
18.4 GPixel/s
Texture Rate
18.2 GTexel/s
Texture Rate
36.8 GTexel/s

Shaders
384 Shaders
Shaders
256 Shaders
TMUs
24 TMUs
TMUs
16 TMUs
ROPs
8 ROPs
ROPs
8 ROPs
Tensor Cores
-
Tensor Cores
16 T-Cores
RT Cores
-
RT Cores
2 RT-Cores
CUs
6 CUs
EUs
16 EUs

Boost Clock
758MHz
Boost Clock
2.3GHz

L2 Cache
256KB shared
L2 Cache
4.1MB shared

Shared MemoryDDR3
Shared Memory
·
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
1.9GT/s
Memory Speed
7.5GT/s
Memory Bandwidth
29.9GB/s
Memory Bandwidth
119.5GB/s

Multi-Monitor
3
Multi-Monitor
3

Encoder Model
VCE 3.1
Encoder Model
Xe Media Engine

Decoder Model
UVD 6.0
Decoder Model
Xe Media Engine

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2016 branding
Branding
Graphics 2024 branding
Codename
Wani
Codename
Xe3 LPG
Chip Variant
-
Chip Variant
GT1
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jan 1, 2017
Release Date
Jan 5, 2026

Foundry
GlobalFoundries
Foundry
Intel
Fabrication Node
28nm
Fabrication Node
Intel 3
Die Size
250mm²
Die Size
27mm²
Transistor Count
3.1 Billion
Transistor Count
-
Transistor Density
12 MTr/mm²
Transistor Density
-

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