GPUs

AMD Radeon R6 6CU 720MHz GCN 3 vs Intel Graphics 4C 2300MHz Full Specs

384 Shaders
720MHz
512 Shaders
2.3GHz
Shared Memory34.1GB/s
·
Shared Memory136.5GB/s
·
··
553 GFLOPS
··
2.35 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Radeon R6 6CU 720MHz GCN 3Radeon R6 6CU 720MHz GCN 3553 GFLOPSFP16
x1
Graphics 4C 2300MHzGraphics 4C 2300MHz75.37 TOPSINT4 Tensor
x136.30

Clock Speed
··
Clock Speed
··
Peak OPS
553 GFLOPSFP16
Peak OPS
75.37 TOPSINT4 Tensor
-
Tensor FP16-32
18.84 TFLOPS
-
Tensor BF16
18.84 TFLOPS
FP32
553 GFLOPS
FP32
2.35 TFLOPS
FP64
34.56 GFLOPS
FP64
588.8 GFLOPS
Tensor INT4
-
Tensor INT4
75.37 TOPS
-
Tensor INT8
37.68 TOPS
Pixel Rate
5.8 GPixel/s
Pixel Rate
36.8 GPixel/s
Texture Rate
17.3 GTexel/s
Texture Rate
73.6 GTexel/s

Shaders
384 Shaders
Shaders
512 Shaders
TMUs
24 TMUs
TMUs
32 TMUs
ROPs
8 ROPs
ROPs
16 ROPs
Tensor Cores
-
Tensor Cores
32 T-Cores
RT Cores
-
RT Cores
4 RT-Cores
CUs
6 CUs
EUs
32 EUs

Boost Clock
720MHz
Boost Clock
2.3GHz

L2 Cache
256KB shared
L2 Cache
4.1MB shared

Shared Memory
·
Shared Memory
·
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
2.1GT/s
Memory Speed
8.5GT/s
Memory Bandwidth
34.1GB/s
Memory Bandwidth
136.5GB/s
ECC
No
ECC
No

Multi-Monitor
3
Multi-Monitor
3

Encoder Model
VCE 3.1
Encoder Model
Xe Media Engine

Decoder Model
UVD 6.0
Decoder Model
Xe Media Engine

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2013 branding
Branding
Graphics 2024 branding
Codename
Wani
Codename
Xe3 LPG
Chip Variant
-
Chip Variant
GT1
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jun 1, 2015
Release Date
Jan 5, 2026

Foundry
GlobalFoundries
Foundry
Intel
Fabrication Node
28nm
Fabrication Node
Intel 3
Die Size
250mm²
Die Size
27mm²
Transistor Count
3.1 Billion
Transistor Count
-
Transistor Density
12 MTr/mm²
Transistor Density
-

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