GPUs

AMD Radeon R6E 4CU 758MHz GCN 3 vs Intel Graphics 96EU 1300MHz Full Specs

256 Shaders
758MHz
768 Shaders
1.3GHz
Shared Memory29.9GB/sDDR4
Shared Memory102.4GB/s
···
··
388.1 GFLOPS
··
2 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Radeon R6E 4CU 758MHz GCN 3Radeon R6E 4CU 758MHz GCN 3388.1 GFLOPSFP16
x1
Graphics 96EU 1300MHzGraphics 96EU 1300MHz3.99 TFLOPSFP16
x10.29

Clock Speed
··
Clock Speed
··
Peak OPS
388.1 GFLOPSFP16
Peak OPS
3.99 TFLOPSFP16
FP32
388.1 GFLOPS
FP32
2 TFLOPS
FP64
24.26 GFLOPS
FP64
499.2 GFLOPS
Pixel Rate
6.1 GPixel/s
Pixel Rate
31.2 GPixel/s
Texture Rate
12.1 GTexel/s
Texture Rate
62.4 GTexel/s

Shaders
256 Shaders
Shaders
768 Shaders
TMUs
16 TMUs
TMUs
48 TMUs
ROPs
8 ROPs
ROPs
24 ROPs
CUs
4 CUs
EUs
96 EUs

Boost Clock
758MHz
Boost Clock
1.3GHz

L2 Cache
256KB shared
L2 Cache
1MB shared
L3 Cache
-
L3 Cache
4MB shared

Shared MemoryDDR4
Shared Memory
···
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
1.9GT/s
Memory Speed
6.4GT/s
Memory Bandwidth
29.9GB/s
Memory Bandwidth
102.4GB/s

Multi-Monitor
3
Multi-Monitor
4

Encoder Model
VCE 3.1
Encoder Model
Quick Sync Video 8

Decoder Model
UVD 6.0
Decoder Model
Quick Sync Video 8

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2016 branding
Branding
Iris Xe branding
Codename
Wani
Codename
Xe LP
Chip Variant
-
Chip Variant
GT1
Market Segment
Laptop
Market Segment
Laptop
Release Date
Feb 23, 2016
Release Date
Jan 8, 2024

Foundry
GlobalFoundries
Foundry
Intel
Fabrication Node
28nm
Fabrication Node
Intel 7
Die Size
250mm²
Die Size
161mm²
Transistor Count
3.1 Billion
Transistor Count
11.9 Billion
Transistor Density
12 MTr/mm²
Transistor Density
74 MTr/mm²

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