GPUs

AMD Radeon R6E 4CU 758MHz GCN 3 vs AMD Radeon 840M 2900MHz Full Specs

256 Shaders
758MHz
256 Shaders
2.9GHz
Shared Memory29.9GB/sDDR4
Shared Memory128GB/s
·
··
388.1 GFLOPS
··
1.49 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Radeon R6E 4CU 758MHz GCN 3Radeon R6E 4CU 758MHz GCN 3388.1 GFLOPSFP16
x1
Radeon 840M 2900MHzRadeon 840M 2900MHz2.97 TFLOPSFP16
x7.65

Clock Speed
··
Clock Speed
···
Peak OPS
388.1 GFLOPSFP16
Peak OPS
2.97 TFLOPSFP16
-
BF16
2.97 TFLOPS
FP32
388.1 GFLOPS
FP32
1.49 TFLOPS
FP64
24.26 GFLOPS
FP64
92.8 GFLOPS
Pixel Rate
6.1 GPixel/s
Pixel Rate
92.8 GPixel/s
Texture Rate
12.1 GTexel/s
Texture Rate
46.4 GTexel/s

Shaders
256 Shaders
Shaders
256 Shaders
TMUs
16 TMUs
TMUs
16 TMUs
ROPs
8 ROPs
ROPs
32 ROPs
RT Cores
-
RT Cores
4 RT-Cores
CUs
4 CUs
CUs
4 CUs

Base Clock
-
Base Clock
1.5GHz
Boost Clock
758MHz
Boost Clock
2.9GHz

L2 Cache
256KB shared
L2 Cache
-

Shared MemoryDDR4
Shared Memory
·
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
1.9GT/s
Memory Speed
8GT/s
Memory Bandwidth
29.9GB/s
Memory Bandwidth
128GB/s
ECC
No
ECC
No

Multi-Monitor
3
Multi-Monitor
4
HDCP
-
HDCP
HDCP 2.3

Encoder Model
VCE 3.1
Encoder Model
VCN 4.0

Decoder Model
UVD 6.0
Decoder Model
VCN 4.0

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2016 branding
Branding
Radeon 2023 branding
Codename
Wani
Codename
Strix Point
Market Segment
Laptop
Market Segment
Laptop
Release Date
Feb 23, 2016
Release Date
Jan 6, 2025

Foundry
GlobalFoundries
Foundry
TSMC
Fabrication Node
28nm
Fabrication Node
N4P
Die Size
250mm²
Die Size
233mm²
Transistor Count
3.1 Billion
Transistor Count
28 Billion
Transistor Density
12 MTr/mm²
Transistor Density
120 MTr/mm²

No images available
No images available