AMD Radeon RX 580X vs NVIDIA GeForce RTX 3050 Laptop 50W Full Specs
2,304 Shaders 1.34GHz | 2,048 Shaders 1.42GHz |
8GB GDDR5256GB/s | 4GB GDDR6192GB/s |
·· 6.17 TFLOPS | ·· 5.8 TFLOPS |
Form Factor PCIe Card | Form Factor Soldered |
TDP 185W | TDP 50W |
Power Connectors 1x 8-Pin | Power Connectors - |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 6.17 TFLOPSFP16 | Peak OPS 185.7 TOPSINT4 Tensor Sparse |
- | Tensor FP16-16 23.22 TFLOPSFP16-16 Tensor Sparse 46.43 TFLOPSTensor FP16-32 11.61 TFLOPSFP16-32 Tensor Sparse 23.22 TFLOPS |
- | BF16 5.8 TFLOPSTensor BF16 11.61 TFLOPSBF16 Tensor Sparse 23.22 TFLOPS |
Tensor TF32 - | Tensor TF32 5.8 TFLOPS |
FP32 6.17 TFLOPS | FP32 5.8 TFLOPS |
FP64 385.9 GFLOPS | FP64 90.69 GFLOPS |
Tensor INT4 - | Tensor INT4 92.86 TOPS |
- | Tensor INT8 46.43 TOPS |
Ray - | Ray 8.75 TOPS |
Pixel Rate 42.9 GPixel/s | Pixel Rate 45.3 GPixel/s |
Texture Rate 193 GTexel/s | Texture Rate 90.7 GTexel/s |
Shaders 2,304 Shaders | Shaders 2,048 Shaders |
TMUs 144 TMUs | TMUs 64 TMUs |
ROPs 32 ROPs | ROPs 32 ROPs |
Tensor Cores - | Tensor Cores 64 T-Cores |
RT Cores - | RT Cores 16 RT-Cores |
CUs 36 CUs | SMs 16 SMs |
Base Clock 1.26GHz | Base Clock 1.19GHz |
Boost Clock 1.34GHz | Boost Clock 1.42GHz |
L2 Cache 2MB shared | L2 Cache 2MB shared |
8GB GDDR5 | 4GB GDDR6 |
Memory Bus 256-bit | Memory Bus 128-bit |
Memory Speed 8GT/s | Memory Speed 12GT/s |
Memory Bandwidth 256GB/s | Memory Bandwidth 192GB/s |
ECC No | ECC No |
TDP 185W | TDP 50W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 2.2 | HDCP HDCP 2.3 |
3x DisplayPort 1.4 | - |
1x HDMI 2.0 | - |
Encoder Model VCE 3.0 | Encoder Model NVENC 7 |
Decoder Model UVD 6.3 | Decoder Model NVDEC 5 |
Form Factor PCIe Card | Form Factor Soldered |
PCIe 2-Slots | PCIe - |
Height 110 mm (4.33")Width 241 mm (9.49")Depth 37 mm (1.46") | - |
Cooling Open-Air 2x Fans | Cooling Open-Air - |
Power Connectors 1x 8-Pin | Power Connectors - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Ellesmere | Codename NV177 |
Chip Variant Polaris 20 XL | Chip Variant GA107-140-A1 |
Market Segment Desktop | Market Segment Laptop |
Release Date Apr 11, 2018 | Release Date May 11, 2021 |
Foundry GlobalFoundries | Foundry Samsung |
Fabrication Node 14LPP | Fabrication Node 8N |
Die Size 232mm² | Die Size 200mm² |
Transistor Count 5.7 Billion | Transistor Count 8.7 Billion |
Transistor Density 24.57 MTr/mm² | Transistor Density 43.5 MTr/mm² |
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