AMD Radeon RX 7600 XT vs ATI Radeon HD 3850 X2 Full Specs
2,048 Shaders 2.75GHz | 640 Shaders 668MHz |
16GB GDDR6288GB/s | 1048MB GDDR3106GB/s |
·· 22.57 TFLOPS | ·· 855 GFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 190W | TDP 140W |
Power Connectors 1x 8-Pin - | Power Connectors 1x 8-Pin 1x 6-Pin |
Clock Speed ··· | Clock Speed ·· |
Peak OPS 90.28 TOPSINT4 Tensor | Peak OPS 855 GFLOPSFP32 |
Tensor FP16-16 22.57 TFLOPSTensor FP16-32 22.57 TFLOPS | - |
BF16 45.14 TFLOPSTensor BF16 22.57 TFLOPS | - |
FP32 22.57 TFLOPS | FP32 855 GFLOPS |
FP64 705.3 GFLOPS | FP64 171 GFLOPS |
Tensor INT4 90.28 TOPS | Tensor INT4 - |
Tensor INT8 22.57 TOPS | - |
Pixel Rate 176.3 GPixel/s | Pixel Rate 10.7 GPixel/s |
Texture Rate 352.6 GTexel/s | Texture Rate 10.7 GTexel/s |
Shaders 2,048 Shaders | Shaders 640 Shaders |
TMUs 128 TMUs | TMUs 32 TMUs |
ROPs 64 ROPs | ROPs 32 ROPs |
Tensor Cores 64 T-Cores | Tensor Cores - |
RT Cores 32 RT-Cores | RT Cores - |
CUs 32 CUs | CUs 8 CUs |
Base Clock 1.98GHz | Base Clock - |
Boost Clock 2.75GHz | Boost Clock 668MHz |
L2 Cache 2MB shared | L2 Cache 256KB shared |
L3 Cache 32MB shared | L3 Cache - |
L3 Bandwidth 1.16TB/s | L3 Bandwidth - |
16GB GDDR6 | 1048MB GDDR3 |
Memory Bus 128-bit | Memory Bus 256-bit |
Memory Speed 18GT/s | Memory Speed 1.7GT/s |
Memory Bandwidth 288GB/s | Memory Bandwidth 106GB/s |
TDP 190W | TDP 140W |
Multi-Monitor 3 | Multi-Monitor 2 |
HDCP HDCP 2.3 | HDCP - |
3x DisplayPort 2.1 | - |
1x HDMI 2.1 | - |
- | 2x DVI-I Dual-Link |
- | 1x S-Video |
Encoder Model VCN 4.0 | - |
Decoder Model VCN 4.0 | Decoder Model UVD 1.0 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2-Slots |
Height 115 mm (4.53")Width 204 mm (8.03")Depth 40 mm (1.57") | - |
Cooling Open-Air 2x Fans | Cooling Open-Air 1x Fan |
Power Connectors 1x 8-Pin | Power Connectors 1x 8-Pin, 1x 6-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Hotpink Bonefish | Codename Boom |
Chip Variant Navi 33 XL | Chip Variant RV670 Pro |
Market Segment Desktop | Market Segment Desktop |
Release Date Jan 8, 2024 | Release Date Apr 4, 2008 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N6 | Fabrication Node 55nm |
Die Size 204mm² | Die Size 192mm² |
Transistor Count 13.3 Billion | Transistor Count 666 Million |
Transistor Density 65.2 MTr/mm² | Transistor Density 3.47 MTr/mm² |
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