AMD Radeon RX 7600 XT vs Intel Arc A770M Full Specs
2,048 Shaders 2.75GHz | 4,096 Shaders 1.65GHz |
16GB GDDR6288GB/s | 16GB GDDR6512GB/s |
·· 22.57 TFLOPS | ·· 13.52 TFLOPS |
Form Factor PCIe Card | Form Factor Soldered |
TDP 190W | TDP 120W |
Power Connectors 1x 8-Pin | Power Connectors - |
Radeon RX 7600 XT90.28 TOPSINT4 Tensor
Arc A770M432.5 TOPSINT4 TensorClock Speed ··· | Clock Speed ··· |
Peak OPS 90.28 TOPSINT4 Tensor | Peak OPS 432.5 TOPSINT4 Tensor |
Tensor FP16-16 22.57 TFLOPSTensor FP16-32 22.57 TFLOPS | Tensor FP16-16 -Tensor FP16-32 108.1 TFLOPS |
BF16 45.14 TFLOPSTensor BF16 22.57 TFLOPS | BF16 -Tensor BF16 108.1 TFLOPS |
FP32 22.57 TFLOPS | FP32 13.52 TFLOPS |
FP64 705.3 GFLOPS | FP64 3.38 TFLOPS |
Tensor INT4 90.28 TOPS | Tensor INT4 432.5 TOPS |
Tensor INT8 22.57 TOPS | Tensor INT8 216.3 TOPS |
Pixel Rate 176.3 GPixel/s | Pixel Rate 211.2 GPixel/s |
Texture Rate 352.6 GTexel/s | Texture Rate 422.4 GTexel/s |
Shaders 2,048 Shaders | Shaders 4,096 Shaders |
TMUs 128 TMUs | TMUs 256 TMUs |
ROPs 64 ROPs | ROPs 128 ROPs |
Tensor Cores 64 T-Cores | Tensor Cores 512 T-Cores |
RT Cores 32 RT-Cores | RT Cores 32 RT-Cores |
CUs 32 CUs | EUs 512 EUs |
Base Clock 1.98GHz | Base Clock 300MHz |
Boost Clock 2.75GHz | Boost Clock 1.65GHz |
L2 Cache 2MB shared | L2 Cache 8.2MB shared |
L3 Cache 32MB shared | L3 Cache - |
L3 Bandwidth 1.16TB/s | L3 Bandwidth - |
16GB GDDR6 | 16GB GDDR6 |
Memory Bus 128-bit | Memory Bus 256-bit |
Memory Speed 18GT/s | Memory Speed 16GT/s |
Memory Bandwidth 288GB/s | Memory Bandwidth 512GB/s |
TDP 190W | TDP 120W |
Multi-Monitor 3 | Multi-Monitor 4 |
HDCP HDCP 2.3 | HDCP - |
3x DisplayPort 2.1 | - |
1x HDMI 2.1 | - |
Encoder Model VCN 4.0 | Encoder Model Arc |
Decoder Model VCN 4.0 | Decoder Model Arc |
Form Factor PCIe Card | Form Factor Soldered |
PCIe 2-Slots | PCIe - |
Height 115 mm (4.53")Width 204 mm (8.03")Depth 40 mm (1.57") | - |
Cooling Open-Air 2x Fans | Cooling Open-Air - |
Power Connectors 1x 8-Pin | Power Connectors - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Hotpink Bonefish | Codename Xe HPG |
Chip Variant Navi 33 XL | Chip Variant DG2-512 |
Market Segment Desktop | Market Segment Laptop |
Release Date Jan 8, 2024 | Release Date Jun 28, 2022 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N6 | Fabrication Node N6 |
Die Size 204mm² | Die Size 406mm² |
Transistor Count 13.3 Billion | Transistor Count 21.7 Billion |
Transistor Density 65.2 MTr/mm² | Transistor Density 53.45 MTr/mm² |
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