AMD Radeon RX 7650 GRE vs Apple Radeon Pro 5700 Full Specs
2,048 Shaders 2.69GHz | 2,304 Shaders 1.35GHz |
8GB GDDR6288GB/s | 8GB GDDR6384GB/s |
·· 22.08 TFLOPS | ·· 6.22 TFLOPS |
Form Factor PCIe Card | Form Factor Soldered |
TDP 165W | TDP 130W |
Power Connectors 1x 8-Pin | Power Connectors - |
Radeon RX 7650 GRE88.31 TOPSINT4 Tensor
Radeon Pro 570012.44 TFLOPSFP16Clock Speed ··· | Clock Speed ··· |
Peak OPS 88.31 TOPSINT4 Tensor | Peak OPS 12.44 TFLOPSFP16 |
Tensor FP16-16 22.08 TFLOPSTensor FP16-32 22.08 TFLOPS | - |
BF16 44.15 TFLOPSTensor BF16 22.08 TFLOPS | - |
FP32 22.08 TFLOPS | FP32 6.22 TFLOPS |
FP64 689.9 GFLOPS | FP64 388.8 GFLOPS |
Tensor INT4 88.31 TOPS | Tensor INT4 - |
Tensor INT8 22.08 TOPS | - |
Pixel Rate 172.5 GPixel/s | Pixel Rate 86.4 GPixel/s |
Texture Rate 345 GTexel/s | Texture Rate 194.4 GTexel/s |
Shaders 2,048 Shaders | Shaders 2,304 Shaders |
TMUs 128 TMUs | TMUs 144 TMUs |
ROPs 64 ROPs | ROPs 64 ROPs |
Tensor Cores 64 T-Cores | Tensor Cores - |
RT Cores 32 RT-Cores | RT Cores - |
CUs 32 CUs | CUs 36 CUs |
Base Clock 1.72GHz | Base Clock 1.24GHz |
Boost Clock 2.69GHz | Boost Clock 1.35GHz |
L2 Cache 2MB shared | L2 Cache 4.1MB shared |
L3 Cache 32MB shared | L3 Cache - |
L3 Bandwidth 1.16TB/s | L3 Bandwidth - |
8GB GDDR6 | 8GB GDDR6 |
Memory Bus 128-bit | Memory Bus 256-bit |
Memory Speed 18GT/s | Memory Speed 12GT/s |
Memory Bandwidth 288GB/s | Memory Bandwidth 384GB/s |
ECC No | ECC No |
TDP 165W | TDP 130W |
Max Temp - | Max Temp 100°C Max |
Multi-Monitor 3 | Multi-Monitor 2 |
HDCP HDCP 2.3 | HDCP HDCP 2.3 |
3x DisplayPort 2.1 | - |
1x HDMI 2.1 | - |
Encoder Model VCN 4.0 | Encoder Model VCN 2.0 |
Decoder Model VCN 4.0 | Decoder Model VCN 2.0 |
Form Factor PCIe Card | Form Factor Soldered |
PCIe 2-Slots | PCIe - |
Height 115 mm (4.53")Width 204 mm (8.03")Depth 40 mm (1.57") | - |
Cooling Open-Air 2x Fans | Cooling Passive - |
Power Connectors 1x 8-Pin | Power Connectors - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Hotpink Bonefish | Codename Gaming |
Chip Variant Navi 33 XL | Chip Variant Navi 10 XE |
Market Segment Desktop | Market Segment Desktop |
Release Date Feb 26, 2025 | Release Date Aug 4, 2020 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N6 | Fabrication Node N7 |
Die Size 204mm² | Die Size 251mm² |
Transistor Count 13.3 Billion | Transistor Count 10.3 Billion |
Transistor Density 65.2 MTr/mm² | Transistor Density 41.04 MTr/mm² |
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All-in-Ones - | All-in-Ones |