GPUs

AMD Radeon RX 7700 vs ATI Radeon HD 4850 X2 Full Specs

3,072 Shaders
2.4GHz
1,600 Shaders
625MHz
12GB GDDR6432GB/s
2GB GDDR3127.4GB/s
··
29.49 TFLOPS
··
2 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
200W
TDP
250W
Power Connectors
1x 8-Pin
-
Power Connectors
1x 8-Pin
1x 6-Pin

Radeon RX 7700Radeon RX 7700118 TOPSINT4 Tensor
x58.98
Radeon HD 4850 X2Radeon HD 4850 X22 TFLOPSFP32 (2x 1 TFLOPS)
x1

Clock Speed
···
Clock Speed
··
Peak OPS
118 TOPSINT4 Tensor
Peak OPS
2 TFLOPSFP32
Tensor FP16-16
29.49 TFLOPS
Tensor FP16-32
29.49 TFLOPS
-
BF16
58.98 TFLOPS
Tensor BF16
29.49 TFLOPS
-
FP32
29.49 TFLOPS
FP32
2 TFLOPS
FP64
921.6 GFLOPS
FP64
400 GFLOPS
Tensor INT4
118 TOPS
Tensor INT4
-
Tensor INT8
29.49 TOPS
-
Pixel Rate
230.4 GPixel/s
Pixel Rate
10 GPixel/s
Texture Rate
460.8 GTexel/s
Texture Rate
25 GTexel/s

Shaders
3,072 Shaders
Shaders
1,600 Shaders
TMUs
192 TMUs
TMUs
80 TMUs
ROPs
96 ROPs
ROPs
32 ROPs
Tensor Cores
96 T-Cores
Tensor Cores
-
RT Cores
48 RT-Cores
RT Cores
-
CUs
48 CUs
CUs
20 CUs

Base Clock
1.9GHz
Base Clock
-
Boost Clock
2.4GHz
Boost Clock
625MHz

L2 Cache
4.1MB shared
L2 Cache
256KB shared
L3 Cache
48MB shared
L3 Cache
-
L3 Bandwidth
1.69TB/s
L3 Bandwidth
-

12GB GDDR6
2GB GDDR3
Memory Bus
192-bit
Memory Bus
256-bit
Memory Speed
18GT/s
Memory Speed
2GT/s
Memory Bandwidth
432GB/s
Memory Bandwidth
127.4GB/s
ECC
No
ECC
No

TDP
200W
TDP
250W

Multi-Monitor
3
Multi-Monitor
4
HDCP
HDCP 2.3
HDCP
-

3x DisplayPort 2.1
-
1x HDMI 2.1
-
-
4x DVI-I Dual-Link
-
1x S-Video

Encoder Model
VCN 4.0
-

Decoder Model
VCN 4.0
Decoder Model
UVD 2.0

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
2.5-Slots
PCIe
2-Slots
Height
111 mm (4.37")
Width
267 mm (10.51")
Depth
50 mm (1.97")
-
Cooling
Open-Air
2x Fans
Cooling
Open-Air
1x Fan
Power Connectors
1x 8-Pin
Power Connectors
1x 8-Pin, 1x 6-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2023 branding
Branding
Radeon 2008 branding
Codename
Wheat Nas
Codename
Wekiva
Chip Variant
Navi 32
Chip Variant
RV770 CE
Market Segment
Desktop
Market Segment
Desktop
Release Date
Aug 25, 2023
Release Date
Nov 7, 2008

Foundry
TSMC
Foundry
TSMC
Other Foundries
TSMCMCD
Other Foundries
-
Fabrication Node
N5
N6MCD
Fabrication Node
55nm
-
Die Size
200mm²
113mm²MCD
Die Size
256mm²
-
Transistor Count
28.1 Billion
6.2 BillionMCD
Transistor Count
956 Million
-
Transistor Density
140.5 MTr/mm²
54.67 MTr/mm²MCD
Transistor Density
3.73 MTr/mm²
-

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