GPUs

AMD Radeon RX 7900 XTX vs Apple 10-Core M4 Full Specs

6,144 Shaders
2.5GHz
1,280 Shaders
1.58GHz
24GB GDDR6960GB/s
Shared Memory120GB/sLPDDR5X
··
61.44 TFLOPS
··
4.04 TFLOPS
Form Factor
PCIe Card
Form Factor
iGPU
TDP
355W
TDP
Shared
Power Connectors
2x 8-Pin
Power Connectors
-

Radeon RX 7900 XTXRadeon RX 7900 XTX245.8 TOPSINT4 Tensor
x60.84
10-Core M410-Core M44.04 TFLOPSFP16
x1

Clock Speed
···
Clock Speed
··
Peak OPS
245.8 TOPSINT4 Tensor
Peak OPS
4.04 TFLOPSFP16
Tensor FP16-16
61.44 TFLOPS
Tensor FP16-32
61.44 TFLOPS
-
BF16
122.9 TFLOPS
Tensor BF16
61.44 TFLOPS
-
FP32
61.44 TFLOPS
FP32
4.04 TFLOPS
FP64
1.92 TFLOPS
-
Tensor INT4
245.8 TOPS
Tensor INT4
-
Tensor INT8
61.44 TOPS
-
Pixel Rate
480 GPixel/s
Pixel Rate
63.1 GPixel/s
Texture Rate
960 GTexel/s
Texture Rate
126.2 GTexel/s

Shaders
6,144 Shaders
Shaders
1,280 Shaders
TMUs
384 TMUs
TMUs
80 TMUs
ROPs
192 ROPs
ROPs
40 ROPs
Tensor Cores
192 T-Cores
Tensor Cores
-
RT Cores
96 RT-Cores
RT Cores
10 RT-Cores
CUs
96 CUs
EUs
160 EUs

Base Clock
1.9GHz
Base Clock
-
Boost Clock
2.5GHz
Boost Clock
1.58GHz

L2 Cache
6.1MB shared
L2 Cache
2MB shared
L3 Cache
96MB shared
L3 Cache
-
L3 Bandwidth
3.5TB/s
L3 Bandwidth
-

24GB GDDR6
Shared MemoryLPDDR5X
Memory Bus
384-bit
Memory Bus
128-bit
Memory Speed
20GT/s
Memory Speed
7.5GT/s
Memory Bandwidth
960GB/s
Memory Bandwidth
120GB/s
ECC
No
ECC
No

TDP
355W
TDP
Shared

Multi-Monitor
3
Multi-Monitor
2
HDCP
HDCP 2.3
HDCP
-

2x DisplayPort 2.1
-
1x HDMI 2.1
-
1x USB-C
-

Encoder Model
VCN 4.0
Encoder Model
Apple Media Engine 3

Decoder Model
VCN 4.0
Decoder Model
Apple Media Engine 3

Form Factor
PCIe Card
Form Factor
iGPU
PCIe
2.5-Slots
PCIe
-
Height
135 mm (5.32")
Width
287 mm (11.3")
Depth
51 mm (2.01")
-
Cooling
Open-Air
3x Fans
Cooling
Open-Air
-
Power Connectors
2x 8-Pin
Power Connectors
-

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2023 branding
Branding
M4 branding
Codename
Plum Bonito
Codename
G16G
Chip Variant
Navi 31 XL
Chip Variant
-
Market Segment
Desktop
Market Segment
Laptop
Release Date
Dec 13, 2022
Release Date
Oct 28, 2024

Foundry
TSMC
Foundry
TSMC
Other Foundries
TSMCMCD
Other Foundries
-
Fabrication Node
N5
N6MCD
Fabrication Node
N3E
-
Die Size
304mm²
225mm²MCD
Die Size
169mm²
-
Transistor Count
45.4 Billion
12.3 BillionMCD
Transistor Count
28 Billion
-
Transistor Density
149.2 MTr/mm²
54.67 MTr/mm²MCD
Transistor Density
165 MTr/mm²
-

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