GPUs

Apple 20-Core M5 Pro vs Intel Iris Pro 6200 1050MHz Full Specs

2,560 Shaders
1.62GHz
384 Shaders
1.05GHz
Shared Memory307.2GB/sLPDDR5X
Shared Memory29.9GB/s
··
··
8.29 TFLOPS
··
806.4 GFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

20-Core M5 Pro20-Core M5 Pro16.59 TFLOPSFP8-16 Tensor
x10.29
Iris Pro 6200 1050MHzIris Pro 6200 1050MHz1.61 TFLOPSFP16
x1

Clock Speed
··
Clock Speed
···
Peak OPS
16.59 TFLOPSFP8-16 Tensor
Peak OPS
1.61 TFLOPSFP16
Tensor FP8-16
16.59 TFLOPS
Tensor FP8-32
16.59 TFLOPS
-
Tensor FP16-16
8.29 TFLOPS
Tensor FP16-32
8.29 TFLOPS
-
FP32
8.29 TFLOPS
FP32
806.4 GFLOPS
-
FP64
201.6 GFLOPS
Pixel Rate
129.6 GPixel/s
Pixel Rate
6.3 GPixel/s
Texture Rate
259.2 GTexel/s
Texture Rate
50.4 GTexel/s

Shaders
2,560 Shaders
Shaders
384 Shaders
TMUs
160 TMUs
TMUs
48 TMUs
ROPs
80 ROPs
ROPs
6 ROPs
Tensor Cores
20 T-Cores
Tensor Cores
-
RT Cores
20 RT-Cores
RT Cores
-
EUs
320 EUs
EUs
48 EUs

Base Clock
-
Base Clock
300MHz
Boost Clock
1.62GHz
Boost Clock
1.05GHz

L2 Cache
4.1MB shared
L2 Cache
-

Shared MemoryLPDDR5X
Shared Memory
··
Memory Bus
256-bit
Memory Bus
128-bit
Memory Speed
9.6GT/s
Memory Speed
1.9GT/s
Memory Bandwidth
307.2GB/s
Memory Bandwidth
29.9GB/s
EDRAM
-
EDRAM
128MBSize
128BitBus Width
100GB/sBandwidth

Multi-Monitor
3
Multi-Monitor
2

Encoder Model
Apple Media Engine 3
Encoder Model
Quick Sync Video 4

Decoder Model
Apple Media Engine 3
Decoder Model
Quick Sync Video 4

Form Factor
iGPU
Form Factor
iGPU
Cooling
Open-Air
Cooling
Passive

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
M5 Pro branding
Branding
Iris Pro 2013 branding
Codename
G17S
Codename
Broadwell
Chip Variant
-
Chip Variant
GT1
Market Segment
Laptop
Market Segment
Desktop
Release Date
Mar 3, 2026
Release Date
Sep 5, 2014

Foundry
TSMC
Foundry
Intel
Fabrication Node
N3P
Fabrication Node
14nm
Die Size
-
Die Size
182mm²
Transistor Count
-
Transistor Count
2.7 Billion
Transistor Density
-
Transistor Density
15 MTr/mm²

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