Apple Radeon Pro 5700 XT vs Intel Arc A770 16GB Full Specs

Summary

2,560 Shaders 1.5GHz	4,096 Shaders 2.4GHz
16GB GDDR6384GB/s	16GB GDDR6560.1GB/s
Peak·FP32·FP16 7.68 TFLOPS	Peak·FP32·FP16 19.66 TFLOPS
Form Factor Soldered	Form Factor PCIe Card
TDP 130W	TDP 225W

Theoretical Performance

Clock Speed1500MHz UC·Base·Boost·OC	Clock Speed2400MHz UC·Base·Boost·OC
Peak OPS 15.36 TFLOPSFP16	Peak OPS 629.1 TOPSINT4 Tensor
-	Tensor FP16-32 157.3 TFLOPS
-	Tensor BF16 157.3 TFLOPS
FP32 7.68 TFLOPS	FP32 19.66 TFLOPS
FP64 480 GFLOPS	FP64 4.92 TFLOPS
Tensor INT4 -	Tensor INT4 629.1 TOPS
-	Tensor INT8 314.6 TOPS
Pixel Rate 96 GPixel/s	Pixel Rate 307.2 GPixel/s
Texture Rate 240 GTexel/s	Texture Rate 614.4 GTexel/s

Core Config

Shaders 2,560 Shaders	Shaders 4,096 Shaders
TMUs 160 TMUs	TMUs 256 TMUs
ROPs 64 ROPs	ROPs 128 ROPs
Tensor Cores -	Tensor Cores 512 T-Cores
RT Cores -	RT Cores 32 RT-Cores
CUs 40 CUs	EUs 512 EUs

Clocks

Base Clock 1.24GHz	Base Clock 2.1GHz
Boost Clock 1.5GHz	Boost Clock 2.4GHz

Cache

L2 Cache 4MB shared

L2 Cache 8MB shared

Memory

16GB GDDR6	16GB GDDR6
Memory Bus 256-bit	Memory Bus 256-bit
Memory Speed 12GT/s	Memory Speed 17.5GT/s
Memory Bandwidth 384GB/s	Memory Bandwidth 560.1GB/s
ECC No	ECC No

Power & Thermals

TDP 130W	TDP 225W
Max Temp 100°C Max	Max Temp -

Video Output

Multi-Monitor 2	Multi-Monitor 4
HDCP HDCP 2.3	HDCP -

Ports

-	3x DisplayPort 2.0 1x HDMI 2.1

Encoder

Encoder Model VCN 2.0	Encoder Model Arc
Codec AVC (H.264) HEVC (H.265) -	Codec AVC (H.264) HEVC (H.265) AV1

Decoder

Decoder Model VCN 2.0	Decoder Model Arc
Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 VP9 AVC (H.264) HEVC (H.265) -	Codec - MPEG-2 - JPEG - VP9 AVC (H.264) HEVC (H.265) AV1

Card

Form Factor Soldered	Form Factor PCIe Card
PCIe -	PCIe 2-Slots
-	Height 98.4 mm (3.87") Width 279.9 mm (11.02") Depth 40 mm (1.57")
Cooling Passive -	Cooling Open-Air 2x Fans

Chip

Manufacturer Apple	Manufacturer Intel
Chip Designer AMD	Chip Designer Intel
Architecture RDNA 1	Architecture Alchemist
Family Radeon Pro	Family Arc A
Branding	Branding
Codename Gaming	Codename Xe HPG
Chip Variant Navi 10 XE	Chip Variant DG2-512
Market Segment Desktop	Market Segment Desktop
Release Date Aug 4, 2020	Release Date Oct 14, 2022

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N7	Fabrication Node N6
Die Size 251mm²	Die Size 406mm²
Transistor Count 10.3 Billion	Transistor Count 21.7 Billion
Transistor Density 41.04 MTr/mm²	Transistor Density 53.45 MTr/mm²

Images