Apple Radeon Pro 575 vs Intel Arc A770 Full Specs

Summary

2,048 Shaders 1.1GHz	4,096 Shaders 2.4GHz
4GB GDDR5217.6GB/s	8GB GDDR6512GB/s
Peak·FP32·FP16 4.49 TFLOPS	Peak·FP32·FP16 19.66 TFLOPS
Form Factor Soldered	Form Factor PCIe Card
TDP 115W	TDP 225W

Theoretical Performance

Clock Speed1096MHz UC·Boost·OC	Clock Speed2400MHz UC·Base·Boost·OC
Peak OPS 4.49 TFLOPSFP16	Peak OPS 629.1 TOPSINT4 Tensor
-	Tensor FP16-32 157.3 TFLOPS
-	Tensor BF16 157.3 TFLOPS
FP32 4.49 TFLOPS	FP32 19.66 TFLOPS
FP64 280.6 GFLOPS	FP64 4.92 TFLOPS
Tensor INT4 -	Tensor INT4 629.1 TOPS
-	Tensor INT8 314.6 TOPS
Pixel Rate 35.1 GPixel/s	Pixel Rate 307.2 GPixel/s
Texture Rate 140.3 GTexel/s	Texture Rate 614.4 GTexel/s

Core Config

Shaders 2,048 Shaders	Shaders 4,096 Shaders
TMUs 128 TMUs	TMUs 256 TMUs
ROPs 32 ROPs	ROPs 128 ROPs
Tensor Cores -	Tensor Cores 512 T-Cores
RT Cores -	RT Cores 32 RT-Cores
CUs 32 CUs	EUs 512 EUs

Clocks

Base Clock -	Base Clock 2.1GHz
Boost Clock 1.1GHz	Boost Clock 2.4GHz

Cache

L2 Cache 2MB shared

L2 Cache 8MB shared

Memory

4GB GDDR5	8GB GDDR6
Memory Bus 256-bit	Memory Bus 256-bit
Memory Speed 6.8GT/s	Memory Speed 16GT/s
Memory Bandwidth 217.6GB/s	Memory Bandwidth 512GB/s
ECC No	ECC No

Power & Thermals

TDP 115W

TDP 225W

Video Output

Multi-Monitor 3	Multi-Monitor 4
HDCP HDCP 2.2	HDCP -

Ports

-	3x DisplayPort 2.0 1x HDMI 2.1

Encoder

Encoder Model VCE 3.0	Encoder Model Arc
Codec AVC (H.264) HEVC (H.265) -	Codec AVC (H.264) HEVC (H.265) AV1

Decoder

Decoder Model UVD 6.3	Decoder Model Arc
Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 - AVC (H.264) HEVC (H.265) -	Codec - MPEG-2 - JPEG - VP9 AVC (H.264) HEVC (H.265) AV1

Card

Form Factor Soldered	Form Factor PCIe Card
PCIe -	PCIe 2-Slots
-	Height 98.4 mm (3.87") Width 279.9 mm (11.02") Depth 40 mm (1.57")
Cooling Open-Air -	Cooling Open-Air 2x Fans

Chip

Manufacturer Apple	Manufacturer Intel
Chip Designer AMD	Chip Designer Intel
Architecture GCN 4	Architecture Alchemist
Family Radeon Pro	Family Arc A
Branding	Branding
Codename Ellesmere	Codename Xe HPG
Chip Variant Polaris 20 XL	Chip Variant DG2-512
Market Segment Laptop	Market Segment Desktop
Release Date Jun 6, 2017	Release Date Oct 14, 2022

Fabrication

Foundry GlobalFoundries	Foundry TSMC
Fabrication Node 14LPP	Fabrication Node N6
Die Size 232mm²	Die Size 406mm²
Transistor Count 5.7 Billion	Transistor Count 21.7 Billion
Transistor Density 24.57 MTr/mm²	Transistor Density 53.45 MTr/mm²

Images