Apple Radeon Pro 580X MPX vs AMD Radeon PRO W7600 Full Specs
2,304 Shaders 1.22GHz | 2,048 Shaders 2.44GHz |
8GB GDDR5218.9GB/s | 8GB GDDR6288GB/s |
·· 5.62 TFLOPS | ·· 19.99 TFLOPS |
Form Factor MPX | Form Factor PCIe Card |
TDP 185W | TDP 130W |
Power Connectors - | Power Connectors 1x 8-Pin |
Radeon Pro 580X MPX5.62 TFLOPSFP16
Radeon PRO W760079.95 TOPSINT4 TensorClock Speed ··· | Clock Speed ··· |
Peak OPS 5.62 TFLOPSFP16 | Peak OPS 79.95 TOPSINT4 Tensor |
- | Tensor FP16-16 19.99 TFLOPSTensor FP16-32 19.99 TFLOPS |
- | BF16 39.98 TFLOPSTensor BF16 19.99 TFLOPS |
FP32 5.62 TFLOPS | FP32 19.99 TFLOPS |
FP64 351.4 GFLOPS | FP64 624.6 GFLOPS |
Tensor INT4 - | Tensor INT4 79.95 TOPS |
- | Tensor INT8 19.99 TOPS |
Pixel Rate 39 GPixel/s | Pixel Rate 156.2 GPixel/s |
Texture Rate 175.7 GTexel/s | Texture Rate 312.3 GTexel/s |
Shaders 2,304 Shaders | Shaders 2,048 Shaders |
TMUs 144 TMUs | TMUs 128 TMUs |
ROPs 32 ROPs | ROPs 64 ROPs |
Tensor Cores - | Tensor Cores 64 T-Cores |
RT Cores - | RT Cores 32 RT-Cores |
CUs 36 CUs | CUs 32 CUs |
Base Clock 1.1GHz | Base Clock 1.72GHz |
Boost Clock 1.22GHz | Boost Clock 2.44GHz |
L2 Cache 2MB shared | L2 Cache 2MB shared |
L3 Cache - | L3 Cache 32MB shared |
L3 Bandwidth - | L3 Bandwidth 1.17TB/s |
8GB GDDR5 | 8GB GDDR6 |
Memory Bus 256-bit | Memory Bus 128-bit |
Memory Speed 6.8GT/s | Memory Speed 18GT/s |
Memory Bandwidth 218.9GB/s | Memory Bandwidth 288GB/s |
TDP 185W | TDP 130W |
Max Temp 100°C Max | Max Temp - |
Multi-Monitor 6 | Multi-Monitor 3 |
HDCP HDCP 2.2 | HDCP HDCP 2.3 |
- | 4x DisplayPort 2.1 |
2x HDMI 2.0 | - |
Encoder Model VCE 3.4 | Encoder Model VCN 4.0 |
Decoder Model UVD 6.3 | Decoder Model VCN 4.0 |
Form Factor MPX | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 1-Slots |
- | Height 115 mm (4.53")Width 241 mm (9.49")Depth 20 mm (0.79") |
Cooling Passive - | Cooling Blower 1x Fan |
Power Connectors - | Power Connectors 1x 8-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Ellesmere | Codename Hotpink Bonefish |
Chip Variant Polaris 20 XL | Chip Variant Navi 33 XL |
Market Segment Workstation | Market Segment Workstation |
Release Date Dec 11, 2019 | Release Date Aug 3, 2023 |
Foundry GlobalFoundries | Foundry TSMC |
Fabrication Node 14LPP | Fabrication Node N6 |
Die Size 232mm² | Die Size 204mm² |
Transistor Count 5.7 Billion | Transistor Count 13.3 Billion |
Transistor Density 24.57 MTr/mm² | Transistor Density 65.2 MTr/mm² |
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Desktops | Desktops - |