Apple Radeon Pro 580X MPX vs NVIDIA GeForce RTX 4070 Super Full Specs
2,304 Shaders 1.22GHz | 7,168 Shaders 2.48GHz |
8GB GDDR5218.9GB/s | 12GB GDDR6X504.2GB/s |
·· 5.62 TFLOPS | ·· 35.48 TFLOPS |
Form Factor MPX | Form Factor PCIe Card |
TDP 185W | TDP 225W |
Power Connectors - | Power Connectors 1x 16-Pin 12VHPWR |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 5.62 TFLOPSFP16 | Peak OPS 1.14 POPSINT4 Tensor Sparse |
- | Tensor FP8-16 283.9 TFLOPSFP8-16 Tensor Sparse 567.7 TFLOPSTensor FP8-32 141.9 TFLOPSFP8-32 Tensor Sparse 283.9 TFLOPS |
- | Tensor FP16-16 141.9 TFLOPSFP16-16 Tensor Sparse 283.9 TFLOPSTensor FP16-32 70.96 TFLOPSFP16-32 Tensor Sparse 141.9 TFLOPS |
- | BF16 35.48 TFLOPSTensor BF16 70.96 TFLOPSBF16 Tensor Sparse 141.9 TFLOPS |
Tensor TF32 - | Tensor TF32 35.48 TFLOPS |
FP32 5.62 TFLOPS | FP32 35.48 TFLOPS |
FP64 351.4 GFLOPS | FP64 554.4 GFLOPS |
Tensor INT4 - | Tensor INT4 567.7 TOPS |
- | Tensor INT8 283.9 TOPS |
Ray - | Ray 82.01 TOPS |
Pixel Rate 39 GPixel/s | Pixel Rate 198 GPixel/s |
Texture Rate 175.7 GTexel/s | Texture Rate 554.4 GTexel/s |
Shaders 2,304 Shaders | Shaders 7,168 Shaders |
TMUs 144 TMUs | TMUs 224 TMUs |
ROPs 32 ROPs | ROPs 80 ROPs |
Tensor Cores - | Tensor Cores 224 T-Cores |
RT Cores - | RT Cores 56 RT-Cores |
CUs 36 CUs | SMs 56 SMs |
Base Clock 1.1GHz | Base Clock 1.98GHz |
Boost Clock 1.22GHz | Boost Clock 2.48GHz |
L2 Cache 2MB shared | L2 Cache 36.9MB shared |
8GB GDDR5 | 12GB GDDR6X |
Memory Bus 256-bit | Memory Bus 192-bit |
Memory Speed 6.8GT/s | Memory Speed 21GT/s |
Memory Bandwidth 218.9GB/s | Memory Bandwidth 504.2GB/s |
ECC No | ECC No |
TDP 185W | TDP 225W |
Max Temp 100°C Max | Max Temp - |
Multi-Monitor 6 | Multi-Monitor 4 |
HDCP HDCP 2.2 | HDCP HDCP 2.3 |
- | 3x DisplayPort 1.4 |
- | 1x HDMI 2.1 |
2x HDMI 2.0 | - |
Encoder Model VCE 3.4 | Encoder Model 2x NVENC 8 |
Decoder Model UVD 6.3 | Decoder Model NVDEC 5 |
Form Factor MPX | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2.1-Slots |
- | Height 112 mm (4.41")Width 267 mm (10.51")Depth 42 mm (1.65") |
Cooling Passive - | Cooling Open-Air 2x Fans |
Power Connectors - | Power Connectors 1x 16-Pin 12VHPWR |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Ellesmere | Codename NV184 |
Chip Variant Polaris 20 XL | Chip Variant AD104-250 |
Market Segment Workstation | Market Segment Desktop |
Release Date Dec 11, 2019 | Release Date Jan 8, 2024 |
Foundry GlobalFoundries | Foundry TSMC |
Fabrication Node 14LPP | Fabrication Node 4N |
Die Size 232mm² | Die Size 295mm² |
Transistor Count 5.7 Billion | Transistor Count 35.8 Billion |
Transistor Density 24.57 MTr/mm² | Transistor Density 121.6 MTr/mm² |
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