ARM Immortalis-G925 MP12 1612MHz vs Imagination IMG BXS-32-1024 MC3 Full Specs
1,536 Shaders 1.61GHz | 1,536 Shaders 1GHz |
Shared Memory85.3GB/sLPDDR5X | Shared Memory |
·· 4.95 TFLOPS | ·· 3.07 TFLOPS |
Form Factor iGPU | Form Factor iGPU |
TDP Shared | TDP Shared |
Immortalis-G925 MP12 1612MHz9.9 TFLOPSFP16
IMG BXS-32-1024 MC36.14 TFLOPSFP16Clock Speed ·· | Clock Speed ·· |
Peak OPS 9.9 TFLOPSFP16 | Peak OPS 6.14 TFLOPSFP16 |
FP32 4.95 TFLOPS | FP32 3.07 TFLOPS |
- | FP64 192 GFLOPS |
Pixel Rate 77.4 GPixel/s | Pixel Rate 96 GPixel/s |
Texture Rate 154.8 GTexel/s | Texture Rate 192 GTexel/s |
Shaders 1,536 Shaders | Shaders 1,536 Shaders |
TMUs 96 TMUs | TMUs 192 TMUs |
ROPs 48 ROPs | ROPs 96 ROPs |
RT Cores 12 RT-Cores | RT Cores - |
EUs 24 EUs | EUs 96 EUs |
Boost Clock 1.61GHz | Boost Clock 1GHz |
Shared MemoryLPDDR5X | Shared Memory |
Memory Bus 64-bit | Memory Bus - |
Memory Speed 10.7GT/s | Memory Speed - |
Memory Bandwidth 85.3GB/s | Memory Bandwidth - |
Form Factor iGPU | Form Factor iGPU |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename - | Codename IMG B-Series |
Market Segment Smartphone | Market Segment Smartphone |
Release Date Oct 1, 2024 | Release Date Oct 13, 2020 |
Foundry TSMC | Foundry - |
Fabrication Node N4P | Fabrication Node - |
Die Size 140mm² | Die Size - |
Transistor Count 22.7 Billion | Transistor Count - |
Transistor Density 162 MTr/mm² | Transistor Density - |
No images available
No images available
CPUs | CPUs - |