ARM Mali-400 MP2 500MHz vs Imagination PowerVR G6430 533MHz Full Specs
8 Shaders 500MHz | 128 Shaders 533MHz |
Shared Memory4.3GB/sLPDDR3 | Shared Memory12.8GB/sLPDDR3 |
·· 8 GFLOPS | ·· 136.5 GFLOPS |
Form Factor iGPU | Form Factor iGPU |
TDP Shared | TDP Shared |
Clock Speed ·· | Clock Speed ·· |
Peak OPS 8 GFLOPSFP32 | Peak OPS 204.7 GFLOPSFP16 |
FP32 8 GFLOPS | FP32 136.5 GFLOPS |
- | FP64 8.53 GFLOPS |
Pixel Rate 1 GPixel/s | Pixel Rate 4.3 GPixel/s |
Texture Rate 1 GTexel/s | Texture Rate 4.3 GTexel/s |
Shaders 8 Shaders | Shaders 128 Shaders |
TMUs 2 TMUs | TMUs 8 TMUs |
ROPs 2 ROPs | ROPs 8 ROPs |
EUs 2 EUs | EUs 8 EUs |
Boost Clock 500MHz | Boost Clock 533MHz |
Shared MemoryLPDDR3 | Shared MemoryLPDDR3 |
Memory Bus 32-bit | Memory Bus 64-bit |
Memory Speed 1.1GT/s | Memory Speed 1.6GT/s |
Memory Bandwidth 4.3GB/s | Memory Bandwidth 12.8GB/s |
ECC No | ECC No |
Multi-Monitor - | Multi-Monitor 1 |
Form Factor iGPU | Form Factor iGPU |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename - | Codename Series6 |
Market Segment Smartphone | Market Segment Smartphone |
Release Date Aug 1, 2013 | Release Date Jul 1, 2014 |
Foundry Samsung | Foundry Intel |
Fabrication Node 45nm | Fabrication Node 22nm |
Die Size - | Die Size 100mm² |
Transistor Count - | Transistor Count 800 Million |
Transistor Density - | Transistor Density 8 MTr/mm² |

