ATI FirePro 3D V3700 vs AMD Radeon PRO W7500 Full Specs

Summary

40 Shaders 800MHz	1,792 Shaders 1.7GHz
262MB GDDR315.2GB/s	8GB GDDR6172GB/s
Peak·FP32·FP16 64 GFLOPS	Peak·FP32·FP16 12.19 TFLOPS
Form Factor PCIe Card	Form Factor PCIe Card
TDP 32W	TDP 70W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-16 Tensor FP16-32 FP64 BF16 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

FirePro 3D V370064 GFLOPSFP32

x1

Radeon PRO W750048.74 TOPSINT4 Tensor

x761.60

Show Top Score

Theoretical Performance

Clock Speed800MHz UC·Boost·OC	Clock Speed1700MHz UC·Base·Boost·OC
Peak OPS 64 GFLOPSFP32	Peak OPS 48.74 TOPSINT4 Tensor
-	Tensor FP16-16 12.19 TFLOPS Tensor FP16-32 12.19 TFLOPS
-	BF16 24.37 TFLOPS Tensor BF16 12.19 TFLOPS
FP32 64 GFLOPS	FP32 12.19 TFLOPS
-	FP64 380.8 GFLOPS
Tensor INT4 -	Tensor INT4 48.74 TOPS
-	Tensor INT8 12.19 TOPS
Pixel Rate 3.2 GPixel/s	Pixel Rate 108.8 GPixel/s
Texture Rate 3.2 GTexel/s	Texture Rate 190.4 GTexel/s

Core Config

Shaders 40 Shaders	Shaders 1,792 Shaders
TMUs 4 TMUs	TMUs 112 TMUs
ROPs 4 ROPs	ROPs 64 ROPs
Tensor Cores -	Tensor Cores 56 T-Cores
RT Cores -	RT Cores 28 RT-Cores
CUs 2 CUs	CUs 28 CUs

Clocks

Base Clock -	Base Clock 1.5GHz
Boost Clock 800MHz	Boost Clock 1.7GHz

Cache

L2 Cache 64KB shared	L2 Cache 2MB shared
L3 Cache -	L3 Cache 32MB shared
L3 Bandwidth -	L3 Bandwidth 1.17TB/s

Memory

262MB GDDR3	8GB GDDR6
Memory Bus 64-bit	Memory Bus 128-bit
Memory Speed 1.9GT/s	Memory Speed 10.8GT/s
Memory Bandwidth 15.2GB/s	Memory Bandwidth 172GB/s

Power & Thermals

TDP 32W

TDP 70W

Video Output

Multi-Monitor 4	Multi-Monitor 3
HDCP -	HDCP HDCP 2.3

Ports

-	4x DisplayPort 2.1
2x DVI-I Dual-Link	-

Encoder

-	Encoder Model VCN 4.0

Decoder

Decoder Model UVD 1.0

Decoder Model VCN 4.0

Card

Form Factor PCIe Card	Form Factor PCIe Card
PCIe 1-Slots	PCIe 1-Slots
Height 111 mm (4.37") Width 168 mm (6.61") Depth 20 mm (0.79")	Height 115 mm (4.53") Width 216 mm (8.5") Depth 20 mm (0.79")
Cooling Blower 1x Fan	Cooling Blower 1x Fan

Chip

Manufacturer ATI	Manufacturer AMD
Chip Designer ATI	Chip Designer AMD
Architecture TeraScale 1	Architecture RDNA 3
Family FirePro V	Family Radeon PRO W
Branding	Branding
Codename Koopa	Codename Hotpink Bonefish
Chip Variant RV620 LE	Chip Variant Navi 33 XL
Market Segment Workstation	Market Segment Workstation
Release Date Aug 8, 2008	Release Date Aug 3, 2023

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node 55nm	Fabrication Node N6
Die Size 67mm²	Die Size 204mm²
Transistor Count 181 Million	Transistor Count 13.3 Billion
Transistor Density 2.7 MTr/mm²	Transistor Density 65.2 MTr/mm²

Images

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Competitors

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