ATI FirePro 3D V8800 vs AMD Radeon PRO W7700 Full Specs

Summary

1,600 Shaders 825MHz	3,072 Shaders 2.6GHz
2GB GDDR5147.2GB/s	16GB GDDR6576GB/s
Peak·FP32·FP16 2.64 TFLOPS	Peak·FP32·FP16 31.95 TFLOPS
Form Factor PCIe Card	Form Factor PCIe Card
TDP 208W	TDP 190W
Power Connectors - 2x 6-Pin	Power Connectors 1x 8-Pin -

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-16 Tensor FP16-32 FP64 BF16 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

FirePro 3D V88002.64 TFLOPSFP32

x1

Radeon PRO W7700127.8 TOPSINT4 Tensor

x48.41

Show Top Score

Theoretical Performance

Clock Speed825MHz UC·Boost·OC	Clock Speed2600MHz UC·Base·Boost·OC
Peak OPS 2.64 TFLOPSFP32	Peak OPS 127.8 TOPSINT4 Tensor
-	Tensor FP16-16 31.95 TFLOPS Tensor FP16-32 31.95 TFLOPS
-	BF16 63.9 TFLOPS Tensor BF16 31.95 TFLOPS
FP32 2.64 TFLOPS	FP32 31.95 TFLOPS
FP64 528 GFLOPS	FP64 998.4 GFLOPS
Tensor INT4 -	Tensor INT4 127.8 TOPS
-	Tensor INT8 31.95 TOPS
Pixel Rate 26.4 GPixel/s	Pixel Rate 249.6 GPixel/s
Texture Rate 66 GTexel/s	Texture Rate 499.2 GTexel/s

Core Config

Shaders 1,600 Shaders	Shaders 3,072 Shaders
TMUs 80 TMUs	TMUs 192 TMUs
ROPs 32 ROPs	ROPs 96 ROPs
Tensor Cores -	Tensor Cores 96 T-Cores
RT Cores -	RT Cores 48 RT-Cores
CUs 20 CUs	CUs 48 CUs

Clocks

Base Clock -	Base Clock 1.9GHz
Boost Clock 825MHz	Boost Clock 2.6GHz

Cache

L2 Cache 512KB shared	L2 Cache 6.1MB shared
L3 Cache -	L3 Cache 64MB shared
L3 Bandwidth -	L3 Bandwidth 2.33TB/s

Memory

2GB GDDR5	16GB GDDR6
Memory Bus 256-bit	Memory Bus 256-bit
Memory Speed 4.6GT/s	Memory Speed 18GT/s
Memory Bandwidth 147.2GB/s	Memory Bandwidth 576GB/s

Power & Thermals

TDP 208W

TDP 190W

Video Output

Multi-Monitor 4	Multi-Monitor 3
HDCP -	HDCP HDCP 2.3

Ports

-	4x DisplayPort 2.1
4x DisplayPort 1.1	-
1x S-Video	-

Encoder

-	Encoder Model VCN 4.0

Decoder

Decoder Model UVD 2.2

Decoder Model VCN 4.0

Card

Form Factor PCIe Card	Form Factor PCIe Card
PCIe 2-Slots	PCIe 2-Slots
Height 111 mm (4.37") Width 267 mm (10.51") Depth 37 mm (1.46")	Height 111 mm (4.37") Width 241 mm (9.49") Depth 40 mm (1.57")
Cooling Blower 1x Fan	Cooling Blower 1x Fan
Power Connectors 2x 6-Pin	Power Connectors 1x 8-Pin

Chip

Manufacturer ATI	Manufacturer AMD
Chip Designer ATI	Chip Designer AMD
Architecture TeraScale 2	Architecture RDNA 3
Family FirePro V	Family Radeon PRO W
Branding	Branding
Codename Cypress	Codename Wheat Nas
Chip Variant Cypress LE	Chip Variant Navi 32
Market Segment Workstation	Market Segment Workstation
Release Date Apr 7, 2010	Release Date Nov 13, 2023

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries -	Other Foundries TSMCMCD
Fabrication Node 40nm -	Fabrication Node N5 N6MCD
Die Size 334mm² -	Die Size 200mm² 150mm²MCD
Transistor Count 2.2 Billion -	Transistor Count 28.1 Billion 8.2 BillionMCD
Transistor Density 6.45 MTr/mm² -	Transistor Density 140.5 MTr/mm² 54.67 MTr/mm²MCD

Images

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Competitors

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