ATI Radeon HD 2900 Pro vs ATI Radeon HD 3850 X2 Full Specs
320 Shaders 600MHz | 640 Shaders 668MHz |
524MB GDDR3102.4GB/s | 1048MB GDDR3106GB/s |
·· 384 GFLOPS | ·· 855 GFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 200W | TDP 140W |
Power Connectors 1x 8-Pin - | Power Connectors 1x 8-Pin 1x 6-Pin |
Clock Speed ·· | Clock Speed ·· |
Peak OPS 384 GFLOPSFP32 | Peak OPS 855 GFLOPSFP32 |
FP32 384 GFLOPS | FP32 855 GFLOPS |
- | FP64 171 GFLOPS |
Pixel Rate 9.6 GPixel/s | Pixel Rate 10.7 GPixel/s |
Texture Rate 9.6 GTexel/s | Texture Rate 10.7 GTexel/s |
Shaders 320 Shaders | Shaders 640 Shaders |
TMUs 16 TMUs | TMUs 32 TMUs |
ROPs 16 ROPs | ROPs 32 ROPs |
CUs 4 CUs | CUs 8 CUs |
Boost Clock 600MHz | Boost Clock 668MHz |
L2 Cache 256KB shared | L2 Cache 256KB shared |
524MB GDDR3 | 1048MB GDDR3 |
Memory Bus 512-bit | Memory Bus 256-bit |
Memory Speed 1.6GT/s | Memory Speed 1.7GT/s |
Memory Bandwidth 102.4GB/s | Memory Bandwidth 106GB/s |
TDP 200W | TDP 140W |
Multi-Monitor 2 | Multi-Monitor 2 |
2x DVI-I Dual-Link | 2x DVI-I Dual-Link |
1x S-Video | 1x S-Video |
Decoder Model UVD 1.0 | Decoder Model UVD 1.0 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2-Slots |
Cooling Blower 1x Fan | Cooling Open-Air 1x Fan |
Power Connectors 1x 8-Pin | Power Connectors 1x 8-Pin, 1x 6-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Pele | Codename Boom |
Chip Variant R600 GT | Chip Variant RV670 Pro |
Market Segment Desktop | Market Segment Desktop |
Release Date Sep 25, 2007 | Release Date Apr 4, 2008 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 80nm | Fabrication Node 55nm |
Die Size 420mm² | Die Size 192mm² |
Transistor Count 720 Million | Transistor Count 666 Million |
Transistor Density 1.71 MTr/mm² | Transistor Density 3.47 MTr/mm² |
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