Imagination PowerVR MBX Lite A2 vs AMD Radeon R5 3CU 900MHz GCN 3 Full Specs

Summary

1 Shader 133MHz	192 Shaders 900MHz
Shared Memory1.1GB/sLPDDR	Shared Memory17.1GB/sDDR4
Peak·FP32·FP16 270 MFLOPS	Peak·FP32·FP16 345.6 GFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Theoretical Performance

Clock Speed133MHz UC·Boost·OC	Clock Speed900MHz UC·Boost·OC
Peak OPS 270 MFLOPSFP32	Peak OPS 345.6 GFLOPSFP16
FP32 270 MFLOPS	FP32 345.6 GFLOPS
-	FP64 21.6 GFLOPS
Pixel Rate 0.1 GPixel/s	Pixel Rate 7.2 GPixel/s
Texture Rate 0.1 GTexel/s	Texture Rate 10.8 GTexel/s

Core Config

Shaders 1 Shader	Shaders 192 Shaders
TMUs 1 TMU	TMUs 12 TMUs
ROPs 1 ROP	ROPs 8 ROPs
EU 1 EU	CUs 3 CUs

Clocks

Boost Clock 133MHz

Boost Clock 900MHz

Cache

L2 Cache -

L2 Cache 128KB shared

Memory

Shared MemoryLPDDR	Shared MemoryDDR4
Memory Bus 32-bit	Memory Bus 64-bit
Memory Speed 266MT/s	Memory Speed 2.1GT/s
Memory Bandwidth 1.1GB/s	Memory Bandwidth 17.1GB/s
ECC No	ECC No

Video Output

Multi-Monitor 1

Multi-Monitor 3

Encoder

-	Encoder Model VCE 3.4
Codec -	Codec AVC (H.264) HEVC (H.265)

Decoder

-	Decoder Model UVD 6.2
Codec -	Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 AVC (H.264) HEVC (H.265)

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Imagination	Manufacturer AMD
Chip Designer Imagination	Chip Designer AMD
Architecture MBX	Architecture GCN 3
Family A Series	Family GCN 3
Branding	Branding
Codename Series4	Codename Stoney
Market Segment Smartphone	Market Segment Laptop
Release Date Sep 9, 2008	Release Date Jun 1, 2018

Fabrication

Foundry Samsung	Foundry GlobalFoundries
Fabrication Node 65nm	Fabrication Node 28nm
Die Size 36mm²	Die Size 125mm²
Transistor Count -	Transistor Count 1.2 Billion
Transistor Density -	Transistor Density 10 MTr/mm²

Images