Intel Arc Pro B60 vs AMD Radeon PRO W7600 Full Specs
2,560 Shaders 2.4GHz | 2,048 Shaders 2.44GHz |
24GB GDDR6456GB/s | 8GB GDDR6288GB/s |
·· 12.29 TFLOPS | ·· 19.99 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 200W | TDP 130W |
Power Connectors 1x 8-Pin | Power Connectors 1x 8-Pin |
Arc Pro B60393.2 TOPSINT4 Tensor
Radeon PRO W760079.95 TOPSINT4 TensorClock Speed ··· | Clock Speed ··· |
Peak OPS 393.2 TOPSINT4 Tensor | Peak OPS 79.95 TOPSINT4 Tensor |
Tensor FP16-16 -Tensor FP16-32 98.3 TFLOPS | Tensor FP16-16 19.99 TFLOPSTensor FP16-32 19.99 TFLOPS |
BF16 -Tensor BF16 98.3 TFLOPS | BF16 39.98 TFLOPSTensor BF16 19.99 TFLOPS |
FP32 12.29 TFLOPS | FP32 19.99 TFLOPS |
FP64 3.07 TFLOPS | FP64 624.6 GFLOPS |
Tensor INT4 393.2 TOPS | Tensor INT4 79.95 TOPS |
Tensor INT8 196.6 TOPS | Tensor INT8 19.99 TOPS |
Pixel Rate 192 GPixel/s | Pixel Rate 156.2 GPixel/s |
Texture Rate 384 GTexel/s | Texture Rate 312.3 GTexel/s |
Shaders 2,560 Shaders | Shaders 2,048 Shaders |
TMUs 160 TMUs | TMUs 128 TMUs |
ROPs 80 ROPs | ROPs 64 ROPs |
Tensor Cores 160 T-Cores | Tensor Cores 64 T-Cores |
RT Cores 20 RT-Cores | RT Cores 32 RT-Cores |
EUs 160 EUs | CUs 32 CUs |
Base Clock 2GHz | Base Clock 1.72GHz |
Boost Clock 2.4GHz | Boost Clock 2.44GHz |
L2 Cache 18.4MB shared | L2 Cache 2MB shared |
L3 Cache - | L3 Cache 32MB shared |
L3 Bandwidth - | L3 Bandwidth 1.17TB/s |
24GB GDDR6 | 8GB GDDR6 |
Memory Bus 192-bit | Memory Bus 128-bit |
Memory Speed 19GT/s | Memory Speed 18GT/s |
Memory Bandwidth 456GB/s | Memory Bandwidth 288GB/s |
TDP 200W | TDP 130W |
Multi-Monitor 4 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
- | 4x DisplayPort 2.1 |
4x Mini DisplayPort 2.1 | - |
Encoder Model Arc | Encoder Model VCN 4.0 |
Decoder Model Arc | Decoder Model VCN 4.0 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 1-Slots |
Height 111 mm (4.37")Width 222 mm (8.74")Depth 40 mm (1.57") | Height 115 mm (4.53")Width 241 mm (9.49")Depth 20 mm (0.79") |
Cooling Blower 1x Fan | Cooling Blower 1x Fan |
Power Connectors 1x 8-Pin | Power Connectors 1x 8-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Xe2 HPG | Codename Hotpink Bonefish |
Chip Variant - | Chip Variant Navi 33 XL |
Market Segment Workstation | Market Segment Workstation |
Release Date May 19, 2025 | Release Date Aug 3, 2023 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N5 | Fabrication Node N6 |
Die Size 272mm² | Die Size 204mm² |
Transistor Count 19.6 Billion | Transistor Count 13.3 Billion |
Transistor Density 72.06 MTr/mm² | Transistor Density 65.2 MTr/mm² |
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