Intel HD 1050MHz Gen 6 vs AMD Radeon 860M 3000MHz Full Specs
48 Shaders 1.05GHz | 384 Shaders 3GHz |
Shared Memory21.3GB/sDDR3 | Shared Memory128GB/s · |
·· 100.8 GFLOPS | ·· 2.3 TFLOPS |
Form Factor iGPU | Form Factor iGPU |
TDP Shared | TDP Shared |
HD 1050MHz Gen 6100.8 GFLOPSFP32
Radeon 860M 3000MHz4.61 TFLOPSFP16Clock Speed ··· | Clock Speed ··· |
Peak OPS 100.8 GFLOPSFP32 | Peak OPS 4.61 TFLOPSFP16 |
- | BF16 4.61 TFLOPS |
FP32 100.8 GFLOPS | FP32 2.3 TFLOPS |
- | FP64 144 GFLOPS |
Pixel Rate 1.1 GPixel/s | Pixel Rate 96 GPixel/s |
Texture Rate 6.3 GTexel/s | Texture Rate 72 GTexel/s |
Shaders 48 Shaders | Shaders 384 Shaders |
TMUs 6 TMUs | TMUs 24 TMUs |
ROPs 1 ROP | ROPs 32 ROPs |
RT Cores - | RT Cores 6 RT-Cores |
EUs 6 EUs | CUs 6 CUs |
Base Clock 650MHz | Base Clock 1.5GHz |
Boost Clock 1.05GHz | Boost Clock 3GHz |
Shared MemoryDDR3 | Shared Memory · |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 1.3GT/s | Memory Speed 8GT/s |
Memory Bandwidth 21.3GB/s | Memory Bandwidth 128GB/s |
ECC No | ECC No |
Multi-Monitor 2 | Multi-Monitor 4 |
HDCP - | HDCP HDCP 2.3 |
- | Encoder Model VCN 4.0 |
- | Decoder Model VCN 4.0 |
Form Factor iGPU | Form Factor iGPU |
Cooling Passive | Cooling Open-Air |
Foundry Intel | Foundry TSMC |
Fabrication Node 32nm | Fabrication Node N4P |
Die Size 131mm² | Die Size 233mm² |
Transistor Count 504 Million | Transistor Count 28 Billion |
Transistor Density 4 MTr/mm² | Transistor Density 120 MTr/mm² |
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CPUs | CPUs |
Laptops - | Laptops |