GPUs

Intel HD 610 900MHz vs AMD Radeon 740M 2800MHz Full Specs

96 Shaders
900MHz
256 Shaders
2.8GHz
Shared Memory34.1GB/s
··
Shared Memory120GB/s
·
··
172.8 GFLOPS
··
1.43 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

HD 610 900MHzHD 610 900MHz172.8 GFLOPSFP16
x1
Radeon 740M 2800MHzRadeon 740M 2800MHz2.87 TFLOPSFP16
x16.59

Clock Speed
···
Clock Speed
···
Peak OPS
172.8 GFLOPSFP16
Peak OPS
2.87 TFLOPSFP16
-
BF16
2.87 TFLOPS
FP32
172.8 GFLOPS
FP32
1.43 TFLOPS
FP64
43.2 GFLOPS
FP64
89.6 GFLOPS
Pixel Rate
1.8 GPixel/s
Pixel Rate
22.4 GPixel/s
Texture Rate
10.8 GTexel/s
Texture Rate
44.8 GTexel/s

Shaders
96 Shaders
Shaders
256 Shaders
TMUs
12 TMUs
TMUs
16 TMUs
ROPs
2 ROPs
ROPs
8 ROPs
RT Cores
-
RT Cores
4 RT-Cores
EUs
12 EUs
CUs
4 CUs

Base Clock
350MHz
Base Clock
1.5GHz
Boost Clock
900MHz
Boost Clock
2.8GHz

Shared Memory
··
Shared Memory
·
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
2.1GT/s
Memory Speed
7.5GT/s
Memory Bandwidth
34.1GB/s
Memory Bandwidth
120GB/s

Multi-Monitor
3
Multi-Monitor
4
HDCP
-
HDCP
HDCP 2.2

Encoder Model
Quick Sync Video 6
Encoder Model
VCN 4.0

Decoder Model
Quick Sync Video 6
Decoder Model
VCN 4.0

Form Factor
iGPU
Form Factor
iGPU
Cooling
Passive
Cooling
Open-Air

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
HD 2016 branding
Branding
Radeon 2023 branding
Codename
Kaby Lake
Codename
Phoenix
Chip Variant
GT1
Chip Variant
-
Market Segment
Desktop
Market Segment
Laptop
Release Date
Jan 1, 2019
Release Date
May 5, 2023

Foundry
Intel
Foundry
TSMC
Fabrication Node
14nm+
Fabrication Node
N4
Die Size
103mm²
Die Size
137mm²
Transistor Count
1.8 Billion
Transistor Count
20.9 Billion
Transistor Density
17 MTr/mm²
Transistor Density
153 MTr/mm²

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