Intel HD 667MHz Gen 5 vs AMD Radeon 840M 2900MHz Full Specs
96 Shaders 667MHz | 256 Shaders 2.9GHz |
Shared Memory17.1GB/sDDR3 | Shared Memory128GB/s · |
·· 128.1 GFLOPS | ·· 1.49 TFLOPS |
Form Factor iGPU | Form Factor iGPU |
TDP Shared | TDP Shared |
HD 667MHz Gen 5128.1 GFLOPSFP32
Radeon 840M 2900MHz2.97 TFLOPSFP16Clock Speed ··· | Clock Speed ··· |
Peak OPS 128.1 GFLOPSFP32 | Peak OPS 2.97 TFLOPSFP16 |
- | BF16 2.97 TFLOPS |
FP32 128.1 GFLOPS | FP32 1.49 TFLOPS |
- | FP64 92.8 GFLOPS |
Pixel Rate 1.3 GPixel/s | Pixel Rate 92.8 GPixel/s |
Texture Rate 10.7 GTexel/s | Texture Rate 46.4 GTexel/s |
Shaders 96 Shaders | Shaders 256 Shaders |
TMUs 16 TMUs | TMUs 16 TMUs |
ROPs 2 ROPs | ROPs 32 ROPs |
RT Cores - | RT Cores 4 RT-Cores |
EUs 12 EUs | CUs 4 CUs |
Base Clock 500MHz | Base Clock 1.5GHz |
Boost Clock 667MHz | Boost Clock 2.9GHz |
Shared MemoryDDR3 | Shared Memory · |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 1.1GT/s | Memory Speed 8GT/s |
Memory Bandwidth 17.1GB/s | Memory Bandwidth 128GB/s |
ECC No | ECC No |
Multi-Monitor 2 | Multi-Monitor 4 |
HDCP - | HDCP HDCP 2.3 |
- | Encoder Model VCN 4.0 |
- | Decoder Model VCN 4.0 |
Form Factor iGPU | Form Factor iGPU |
Foundry Intel | Foundry TSMC |
Fabrication Node 32nm | Fabrication Node N4P |
Die Size 81mm² | Die Size 233mm² |
Transistor Count 382 Million | Transistor Count 28 Billion |
Transistor Density 5 MTr/mm² | Transistor Density 120 MTr/mm² |
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CPUs | CPUs |
Laptops - | Laptops |