GPUs

Intel HD 756MHz Gen 7 vs AMD Radeon 840M 2900MHz Full Specs

32 Shaders
756MHz
256 Shaders
2.9GHz
Shared Memory8.5GB/sDDR3L
Shared Memory128GB/s
·
··
48.38 GFLOPS
··
1.49 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

HD 756MHz Gen 7HD 756MHz Gen 748.38 GFLOPSFP32
x1
Radeon 840M 2900MHzRadeon 840M 2900MHz2.97 TFLOPSFP16
x61.38

Clock Speed
···
Clock Speed
···
Peak OPS
48.38 GFLOPSFP32
Peak OPS
2.97 TFLOPSFP16
-
BF16
2.97 TFLOPS
FP32
48.38 GFLOPS
FP32
1.49 TFLOPS
FP64
12.1 GFLOPS
FP64
92.8 GFLOPS
Pixel Rate
0.8 GPixel/s
Pixel Rate
92.8 GPixel/s
Texture Rate
3 GTexel/s
Texture Rate
46.4 GTexel/s

Shaders
32 Shaders
Shaders
256 Shaders
TMUs
4 TMUs
TMUs
16 TMUs
ROPs
1 ROP
ROPs
32 ROPs
RT Cores
-
RT Cores
4 RT-Cores
EUs
4 EUs
CUs
4 CUs

Base Clock
313MHz
Base Clock
1.5GHz
Boost Clock
756MHz
Boost Clock
2.9GHz

Shared MemoryDDR3L
Shared Memory
·
Memory Bus
64-bit
Memory Bus
128-bit
Memory Speed
1.1GT/s
Memory Speed
8GT/s
Memory Bandwidth
8.5GB/s
Memory Bandwidth
128GB/s
ECC
No
ECC
No

Multi-Monitor
2
Multi-Monitor
4
HDCP
-
HDCP
HDCP 2.3

Encoder Model
Quick Sync Video 2
Encoder Model
VCN 4.0

Decoder Model
Quick Sync Video 2
Decoder Model
VCN 4.0

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
HD 2013 branding
Branding
Radeon 2023 branding
Codename
Bay Trail
Codename
Strix Point
Chip Variant
GT1
Chip Variant
-
Market Segment
Laptop
Market Segment
Laptop
Release Date
Sep 2, 2013
Release Date
Jan 6, 2025

Foundry
Intel
Foundry
TSMC
Fabrication Node
22nm
Fabrication Node
N4P
Die Size
70mm²
Die Size
233mm²
Transistor Count
550 Million
Transistor Count
28 Billion
Transistor Density
8 MTr/mm²
Transistor Density
120 MTr/mm²

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