GPUs

Intel Iris Plus 650 1150MHz vs AMD Radeon 840M 2900MHz Full Specs

384 Shaders
1.15GHz
256 Shaders
2.9GHz
Shared Memory34.1GB/s
··
Shared Memory128GB/s
·
··
883.2 GFLOPS
··
1.49 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Iris Plus 650 1150MHzIris Plus 650 1150MHz883.2 GFLOPSFP16
x1
Radeon 840M 2900MHzRadeon 840M 2900MHz2.97 TFLOPSFP16
x3.36

Clock Speed
···
Clock Speed
···
Peak OPS
883.2 GFLOPSFP16
Peak OPS
2.97 TFLOPSFP16
-
BF16
2.97 TFLOPS
FP32
883.2 GFLOPS
FP32
1.49 TFLOPS
FP64
220.8 GFLOPS
FP64
92.8 GFLOPS
Pixel Rate
6.9 GPixel/s
Pixel Rate
92.8 GPixel/s
Texture Rate
55.2 GTexel/s
Texture Rate
46.4 GTexel/s

Shaders
384 Shaders
Shaders
256 Shaders
TMUs
48 TMUs
TMUs
16 TMUs
ROPs
6 ROPs
ROPs
32 ROPs
RT Cores
-
RT Cores
4 RT-Cores
EUs
48 EUs
CUs
4 CUs

Base Clock
300MHz
Base Clock
1.5GHz
Boost Clock
1.15GHz
Boost Clock
2.9GHz

Shared Memory
··
Shared Memory
·
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
2.1GT/s
Memory Speed
8GT/s
Memory Bandwidth
34.1GB/s
Memory Bandwidth
128GB/s

Multi-Monitor
3
Multi-Monitor
4
HDCP
-
HDCP
HDCP 2.3

Encoder Model
Quick Sync Video 6
Encoder Model
VCN 4.0

Decoder Model
Quick Sync Video 6
Decoder Model
VCN 4.0

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Iris Plus branding
Branding
Radeon 2023 branding
Codename
Kaby Lake
Codename
Strix Point
Chip Variant
GT1
Chip Variant
-
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jan 3, 2017
Release Date
Jan 6, 2025

Foundry
Intel
Foundry
TSMC
Fabrication Node
14nm+
Fabrication Node
N4P
Die Size
148mm²
Die Size
233mm²
Transistor Count
2.5 Billion
Transistor Count
28 Billion
Transistor Density
17 MTr/mm²
Transistor Density
120 MTr/mm²

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