GPUs

NVIDIA GB10 vs Apple Radeon Pro 580X MPX Full Specs

6,144 Shaders
2.52GHz
2,304 Shaders
1.22GHz
Shared Memory273.1GB/sLPDDR5X
8GB GDDR5218.9GB/s
··
31.03 TFLOPS
··
5.62 TFLOPS
Form Factor
iGPU
Form Factor
MPX
TDP
Shared
TDP
185W

GB10GB10992.9 TFLOPSFP4 Tensor Sparse
x176.61
Radeon Pro 580X MPXRadeon Pro 580X MPX5.62 TFLOPSFP16
x1

Clock Speed
···
Clock Speed
···
Peak OPS
992.9 TFLOPSFP4 Tensor Sparse
Peak OPS
5.62 TFLOPSFP16
Tensor FP4
496.4 TFLOPS
FP4 Tensor Sparse
992.9 TFLOPS
-
Tensor FP8-16
248.2 TFLOPS
FP8-16 Tensor Sparse
496.4 TFLOPS
Tensor FP8-32
124.1 TFLOPS
FP8-32 Tensor Sparse
248.2 TFLOPS
-
Tensor FP16-16
124.1 TFLOPS
FP16-16 Tensor Sparse
248.2 TFLOPS
Tensor FP16-32
62.05 TFLOPS
FP16-32 Tensor Sparse
124.1 TFLOPS
-
BF16
62.05 TFLOPS
Tensor BF16
62.05 TFLOPS
BF16 Tensor Sparse
124.1 TFLOPS
-
Tensor TF32
31.03 TFLOPS
Tensor TF32
-
FP32
31.03 TFLOPS
FP32
5.62 TFLOPS
FP64
15.51 TFLOPS
FP64
351.4 GFLOPS
Tensor INT8
248.2 TOPS
-
Ray
94.1 TOPS
Ray
-
Pixel Rate
80.8 GPixel/s
Pixel Rate
39 GPixel/s
Texture Rate
484.8 GTexel/s
Texture Rate
175.7 GTexel/s

Shaders
6,144 Shaders
Shaders
2,304 Shaders
TMUs
192 TMUs
TMUs
144 TMUs
ROPs
32 ROPs
ROPs
32 ROPs
Tensor Cores
192 T-Cores
Tensor Cores
-
RT Cores
48 RT-Cores
RT Cores
-
SMs
48 SMs
CUs
36 CUs

Base Clock
2.42GHz
Base Clock
1.1GHz
Boost Clock
2.52GHz
Boost Clock
1.22GHz

L2 Cache
24.6MB shared
L2 Cache
2MB shared

Shared MemoryLPDDR5X
8GB GDDR5
Memory Bus
256-bit
Memory Bus
256-bit
Memory Speed
8.5GT/s
Memory Speed
6.8GT/s
Memory Bandwidth
273.1GB/s
Memory Bandwidth
218.9GB/s
ECC
No
ECC
No

TDP
Shared
TDP
185W
Max Temp
-
Max Temp
100°C Max

Multi-Monitor
4
Multi-Monitor
6
HDCP
HDCP 2.3
HDCP
HDCP 2.2

-
2x HDMI 2.0

Encoder Model
NVENC 9
Encoder Model
VCE 3.4

Decoder Model
NVDEC 6
Decoder Model
UVD 6.3

Form Factor
iGPU
Form Factor
MPX
PCIe
-
PCIe
2-Slots
Cooling
Open-Air
Cooling
Passive

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
-
Family
Branding
GB10 branding
Branding
Radeon Pro 2016 branding
Codename
Thor
Codename
Ellesmere
Chip Variant
-
Chip Variant
Polaris 20 XL
Market Segment
Embedded
Market Segment
Workstation
Release Date
Jan 6, 2025
Release Date
Dec 11, 2019

Foundry
TSMC
Foundry
GlobalFoundries
Fabrication Node
N3E
Fabrication Node
14LPP
Die Size
-
Die Size
232mm²
Transistor Count
-
Transistor Count
5.7 Billion
Transistor Density
-
Transistor Density
24.57 MTr/mm²

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