Intel Core i5-1135G7 vs Qualcomm Snapdragon X Plus (X1P-64-100) Full Specs

Summary

4 Cores 8 Threads 1.4GHz	10 Cores 10 Threads 3.4GHz
TDP 15W	TDP 23W
Bandwidth 59.7GB/s LPDDR4X·DDR4	Bandwidth 135.2GB/s LPDDR5X
iGPU Iris Xe 80EU 1300MHz	iGPU Adreno X1 3.8T
Peak·FP32·FP16 3.33 TFLOPSFP16	Peak·FP32·FP16 7.68 TFLOPSFP16
Socket BGA 1449	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core i5-1135G71,670

x1

Snapdragon X Plus (X1P-64-100)2,349

x1.41

Show Top Score

Core Config

4 Cores	10 Cores
8 Threads	10 Threads

Clocks

Base Clock 1.4GHz	Base Clock 3.4GHz
Boost Clock 4.2GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 192KB
L1d 48KB	L1d 96KB
L2 1.25MB	L2 36MB shared
L3 8MB	L3 -
SLC Cache -	SLC Cache 6MB

Memory

Type LPDDR4X·DDR4	Type LPDDR5X
Max Memory 32GB	Max Memory 64GB
ECC No	ECC No
Channels 2	Channels 8
Bus Width 128-bit	Bus Width 128-bit
Speed 3733MT/s	Speed 8448MT/s
Bandwidth 59.7GB/s	Bandwidth 135.2GB/s
Bandwidth Calculator Channels Transfer Rate3733MT/s Calculated Bandwidth 59.7GB/s	Bandwidth Calculator Channels Transfer Rate8448MT/s Calculated Bandwidth 135.2GB/s

Power & Thermals

TDP 15W	TDP 23W
cTDP-down 12W	cTDP-down -
cTDP-up 28W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp -

Chipset Bus

Bus Type OPI	Bus Type -
Bus Config 8 lanes	Bus Config -
Bus Speed 4GT/s	Bus Speed -
Bus Bandwidth 4GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 4.0 x4 7.9GB/sBandwidth	PCIe PCIe 4.0 x12 23.6GB/sBandwidth
-	PCIe Secondary PCIe 3.0 x4 3.9GB/sBandwidth

iGPU

iGPU Iris Xe 80EU 1300MHz	iGPU Adreno X1 3.8T
Shaders 640	Shaders 1536
Boost Clock 1.3GHz	Boost Clock 1.25GHz
Peak·FP32·FP16 3.33 TFLOPSFP16	Peak·FP32·FP16 7.68 TFLOPSFP16

NPU

NPU Model GNA 2.0	NPU Model Hexagon
Performance -	Performance 45 TOPSINT8

Controller

Controller Model 500 Series UP3+	Controller Model -
Codename Tiger Lake	Codename -
PCIe -	PCIe -

Chip

Manufacturer Intel	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Tiger Lake	Architecture OryonARMv8.7-A
Family Core 11th Gen	Family X Series
Branding	Branding
Codename Tiger Lake-H35 Tiger Lake-4C-GT3Variant Willow CoveP-Core	Codename Hamoa Snapdragon X EliteVariant PhoenixP-Core
Market Segment Laptop	Market Segment Laptop
Release Date Sep 2, 2020	Release Date Apr 24, 2024

Fabrication

Foundry Intel	Foundry TSMC
Other Foundries IntelPCH	Other Foundries -
Fabrication Node 10nm SuperFin 14nmPCH	Fabrication Node N4P -
Die Size 146mm² 55mm²PCH	Die Size 170mm² -
Transistor Count 9.5 Billion	Transistor Count -
Transistor Density 65 MTr/mm²	Transistor Density -

Images

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Used In

Laptops Book 13(Late 2020)XPS 13(9310, Late 2020)XPS 13 2-in-1(29310, Late 2020) Show 18 more	Laptops XPS 13(9345, Mid 2024)Inspiron 14(5441, Late 2024)Inspiron 14 Plus(7441, Late 2024) Show 2 more
Tablets Surface Pro 7+(Intel 11th Gen, Early 2021)Surface Pro 8(Intel 11th Gen, Late 2021)	Tablets Surface Pro 11(X Elite, Mid 2024)

Competitors

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QualcommSnapdragon X Plus (X1P-64-100) vs CPU QualcommSnapdragon X2 Elite (X2E-80-100) QualcommSnapdragon X Plus (X1P-64-100) vs CPU AMDRyzen AI 7 PRO 350 QualcommSnapdragon X Plus (X1P-64-100) vs CPU AMDRyzen AI 7 350 Show 12 more