Intel Core m3-8100Y vs AMD Ryzen 3 3300U Full Specs

Summary

2 Cores 4 Threads 1.1GHz	4 Cores 4 Threads 2.1GHz
TDP 5W	TDP 15W
Bandwidth 29.9GB/s LPDDR3·DDR3L	Bandwidth 38.4GB/s DDR4
iGPU UHD 615 900MHz	iGPU Radeon Vega 6 1200MHz
Peak·FP32·FP16 345.6 GFLOPSFP16	Peak·FP32·FP16 1.84 TFLOPSFP16
Socket BGA 1515	Socket FP5

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Core m3-8100Y1,087

x1.23

Ryzen 3 3300U881

x1

Show Top Score

Core Config

2 Cores	4 Cores
4 Threads	4 Threads

Clocks

Base Clock 1.1GHz	Base Clock 2.1GHz
Boost Clock 3.4GHz	Boost Clock 3.5GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 64KB
L1d 32KB	L1d 32KB
L2 256KB	L2 512KB
L3 4MB	L3 4MB

Memory

Type LPDDR3·DDR3L	Type DDR4
Max Memory 16GB	Max Memory 64GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 1866MT/s	Speed 2400MT/s
Bandwidth 29.9GB/s	Bandwidth 38.4GB/s
Bandwidth Calculator Channels Transfer Rate1866MT/s Calculated Bandwidth 29.9GB/s	Bandwidth Calculator Channels Transfer Rate2400MT/s Calculated Bandwidth 38.4GB/s

Power & Thermals

TDP 5W	TDP 15W
cTDP-down 4W	cTDP-down 12W
cTDP-up 7W	cTDP-up 25W
Max Operating Temp 100°C Max	Max Operating Temp 105°C Max
Included Cooler -	Included Cooler 0

Chipset Bus

Bus Type OPI	Bus Type PCIe
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 4GT/s	Bus Speed 8GT/s
Bus Bandwidth 2GB/s	Bus Bandwidth 4GB/s

Expansion

PCIe PCIe 3.0 x10 9.8GB/sBandwidth

PCIe PCIe 3.0 x12 11.8GB/sBandwidth

iGPU

iGPU UHD 615 900MHz	iGPU Radeon Vega 6 1200MHz
Shaders 192	Shaders 384
Boost Clock 900MHz	Boost Clock 1.2GHz
Peak·FP32·FP16 345.6 GFLOPSFP16	Peak·FP32·FP16 1.84 TFLOPSFP16

Controller

Controller Model 300 Series Y+	Controller Model -
Codename Amber Lake	Codename -
PCIe -	PCIe -

Chip

Manufacturer Intel	Manufacturer AMD
ISA x86-64	ISA x86-64
Architecture Skylake	Architecture Zen+
Family Core 6th Gen	Family Ryzen 3000
Branding	Branding
Codename Amber Lake-Y Amber Lake-2CVariant	Codename Picasso -
Market Segment Laptop	Market Segment Laptop
Release Date Aug 30, 2018	Release Date Jan 6, 2019

Fabrication

Foundry Intel	Foundry GlobalFoundries
Other Foundries IntelPCH	Other Foundries -
Fabrication Node 14nm++ 22nmPCH	Fabrication Node 12LP -
Die Size 103mm² 52mm²PCH	Die Size 210mm² -
Transistor Count 1.8 Billion	Transistor Count 4.9 Billion
Transistor Density 17 MTr/mm²	Transistor Density 24 MTr/mm²

Images

No images available

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Used In

Tablets Surface Go 2(Amber Lake, Mid 2020)

Tablets -

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