AMD Ryzen 3 3300U vs Intel Core m3-8100Y Full Specs

Summary

4 Cores 4 Threads 2.1GHz	2 Cores 4 Threads 1.1GHz
TDP 15W	TDP 5W
Bandwidth 38.4GB/s DDR4	Bandwidth 29.9GB/s LPDDR3·DDR3L
iGPU Radeon Vega 6 1200MHz	iGPU UHD 615 900MHz
Peak·FP32·FP16 1.84 TFLOPSFP16	Peak·FP32·FP16 345.6 GFLOPSFP16
Socket FP5	Socket BGA 1515

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Ryzen 3 3300U881

x1

Core m3-8100Y1,087

x1.23

Show Top Score

Core Config

4 Cores	2 Cores
4 Threads	4 Threads

Clocks

Base Clock 2.1GHz	Base Clock 1.1GHz
Boost Clock 3.5GHz	Boost Clock 3.4GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB	L1i 32KB
L1d 32KB	L1d 32KB
L2 512KB	L2 256KB
L3 4MB	L3 4MB

Memory

Type DDR4	Type LPDDR3·DDR3L
Max Memory 64GB	Max Memory 16GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 2400MT/s	Speed 1866MT/s
Bandwidth 38.4GB/s	Bandwidth 29.9GB/s
Bandwidth Calculator Channels Transfer Rate2400MT/s Calculated Bandwidth 38.4GB/s	Bandwidth Calculator Channels Transfer Rate1866MT/s Calculated Bandwidth 29.9GB/s

Power & Thermals

TDP 15W	TDP 5W
cTDP-down 12W	cTDP-down 4W
cTDP-up 25W	cTDP-up 7W
Max Operating Temp 105°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type PCIe	Bus Type OPI
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 8GT/s	Bus Speed 4GT/s
Bus Bandwidth 4GB/s	Bus Bandwidth 2GB/s

Expansion

PCIe PCIe 3.0 x12 11.8GB/sBandwidth

PCIe PCIe 3.0 x10 9.8GB/sBandwidth

iGPU

iGPU Radeon Vega 6 1200MHz	iGPU UHD 615 900MHz
Shaders 384	Shaders 192
Boost Clock 1.2GHz	Boost Clock 900MHz
Peak·FP32·FP16 1.84 TFLOPSFP16	Peak·FP32·FP16 345.6 GFLOPSFP16

Controller

Controller Model -	Controller Model 300 Series Y+
Codename -	Codename Amber Lake
PCIe -	PCIe -

Chip

Manufacturer AMD	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Zen+	Architecture Skylake
Family Ryzen 3000	Family Core 6th Gen
Branding	Branding
Codename Picasso -	Codename Amber Lake-Y Amber Lake-2CVariant
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2019	Release Date Aug 30, 2018

Fabrication

Foundry GlobalFoundries	Foundry Intel
Other Foundries -	Other Foundries IntelPCH
Fabrication Node 12LP -	Fabrication Node 14nm++ 22nmPCH
Die Size 210mm² -	Die Size 103mm² 52mm²PCH
Transistor Count 4.9 Billion	Transistor Count 1.8 Billion
Transistor Density 24 MTr/mm²	Transistor Density 17 MTr/mm²

Images

No images available

No images available

Used In

Tablets -

Tablets Surface Go 2(Amber Lake, Mid 2020)

Competitors

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