AMD Ryzen AI 9 365 vs Apple M2 Pro (12C19G) Full Specs

Summary

10 Cores(4P+6E) 20 Threads(8P+12E) 2GHz	12 Cores(8P+4E) 12 Threads(8P+4E) 3.5GHz
TDP 28W	TDP 60W
Bandwidth 128GB/s LPDDR5X·DDR5	Bandwidth 204.8GB/s LPDDR5
iGPU Radeon 880M 2900MHz	iGPU 19-Core M2 Pro
Peak·FP32·FP16 8.91 TFLOPSFP16	Peak·FP32·FP16 6.8 TFLOPSFP16
Socket FP8	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Ryzen AI 9 3652,790

x1.04

M2 Pro (12C19G)2,680

x1

Show Top Score

Core Config

10 Cores 4P 6E	12 Cores 8P 4E
20 Threads 8P 12E	12 Threads 8P 4E

Clocks

Base Clock 2GHz	Base Clock 3.5GHz
Boost Clock 5GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 192KB P 128KB E
L1d 48KB P -	L1d 128KB P 64KB E
L2 1MB P - -	L2 24MB P shared 4MB E shared
L3 24MB	L3 -
SLC Cache -	SLC Cache 24MB

Memory

Type LPDDR5X·DDR5	Type LPDDR5
Max Memory 256GB	Max Memory 32GB
ECC No	ECC No
Channels 2	Channels 4
Bus Width 128-bit	Bus Width 256-bit
Speed 8000MT/s	Speed 6400MT/s
Bandwidth 128GB/s	Bandwidth 204.8GB/s
Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 128GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 204.8GB/s

Power & Thermals

TDP 28W	TDP 60W
cTDP-down 15W	cTDP-down -
cTDP-up 54W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type PCIe	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 8GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

iGPU

iGPU Radeon 880M 2900MHz	iGPU 19-Core M2 Pro
Shaders 768	Shaders 2432
Boost Clock 2.9GHz	Boost Clock 1.4GHz
Peak·FP32·FP16 8.91 TFLOPSFP16	Peak·FP32·FP16 6.8 TFLOPSFP16

NPU

NPU Model XDNA 2	NPU Model H14 Selene
NPU Cores 32	NPU Cores 16
NPU Clock -	NPU Clock 2.1GHz
Performance 50 TOPSINT8	Performance 15.8 TOPSFP16

Chip

Manufacturer AMD	Manufacturer Apple
ISA x86-64	ISA AArch64
Architecture Zen 5	Architecture Apple Silicon 11ARMv8.5-A
Family Ryzen AI 300	Family M Series
Branding	Branding
Codename Strix Point - Zen 5P-Core Zen 5cE-Core	Codename Rhodes-Chop M2 ProVariant AvalancheP-Core BlizzardE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jun 2, 2024	Release Date Jan 17, 2023

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N4P	Fabrication Node N5P
Die Size 233mm²	Die Size 295mm²
Transistor Count 28 Billion	Transistor Count 40 Billion
Transistor Density 120 MTr/mm²	Transistor Density 136 MTr/mm²

Images

No images available

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Used In

Laptops Blade 16(Early 2025)	Laptops MacBook Pro 14(M2 Pro, Early 2023)MacBook Pro 16(M2 Pro, Early 2023)
Desktops -	Desktops Mac mini(M2 Pro, Early 2023)

Competitors

AMDRyzen AI 9 365 vs CPU AMDRyzen AI 7 PRO 350 AMDRyzen AI 9 365 vs CPU AMDRyzen AI 7 350 AMDRyzen AI 9 365 vs CPU AMDRyzen 9 270 Show 12 more

AppleM2 Pro (12C19G) vs CPU AppleM5 Pro (15C16G) AppleM2 Pro (12C19G) vs CPU AppleM5 Pro (18C20G) AppleM2 Pro (12C19G) vs CPU AMDRyzen AI Max 390 Show 12 more