AMD Ryzen AI 9 365 vs Apple M5 Pro (18C20G) Full Specs
10 Cores(4P+6E) 20 Threads(8P+12E) 2GHz | 18 Cores(6P+12M) 18 Threads(6P+12M) 4.61GHz |
TDP 28W | TDP 60W |
Bandwidth 128GB/s · | Bandwidth 307.2GB/s LPDDR5X |
iGPU | iGPU |
·· 8.91 TFLOPSFP16 | ·· 16.59 TFLOPSFP16 |
Socket | Socket - |
Ryzen AI 9 3652,790
M5 Pro (18C20G)4,26810 Cores 4P - 6E | 18 Cores 6P 12M - |
20 Threads 8P - 12E | 18 Threads 6P 12M - |
Base Clock 2GHz | Base Clock 4.61GHz |
Boost Clock 5GHz | Boost Clock - |
Overclocking Locked | Overclocking Locked |
L1i 32KB P - | L1i 192KB P 192KB M |
L1d 48KB P - | L1d 128KB P 128KB M |
L2 1MB P - - | L2 1MB P 16MB P shared 16MB M shared |
L3 24MB | L3 - |
SLC Cache - | SLC Cache 24MB |
Type · | Type LPDDR5X |
Max Memory 256GB | Max Memory 64GB |
ECC No | ECC No |
Channels 2 | Channels 4 |
Bus Width 128-bit | Bus Width 256-bit |
Speed 8000MT/s | Speed 9600MT/s |
Bandwidth 128GB/s | Bandwidth 307.2GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 128GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 307.2GB/s |
TDP 28W | TDP 60W |
cTDP-down 15W | cTDP-down - |
cTDP-up 54W | cTDP-up - |
Max Operating Temp 100°C Max | Max Operating Temp 100°C Max |
Included Cooler 0 | Included Cooler - |
Bus Type PCIe | Bus Type - |
Bus Config 4 lanes | Bus Config - |
Bus Speed 16GT/s | Bus Speed - |
Bus Bandwidth 8GB/s | Bus Bandwidth - |
PCIe PCIe 4.0 x1631.5GB/sBandwidth | PCIe PCIe 4.0 x1631.5GB/sBandwidth |
iGPU | iGPU |
Shaders 768 | Shaders 2560 |
Boost Clock 2.9GHz | Boost Clock 1.62GHz |
·· 8.91 TFLOPSFP16 | ·· 16.59 TFLOPSFP16 |
NPU Model XDNA 2 | NPU Model H17 Hyperion |
NPU Cores 32 | NPU Cores 16 |
NPU Clock - | NPU Clock 2.45GHz |
Performance 50 TOPSINT8 | Performance 38 TOPSINT8 |
Manufacturer | Manufacturer |
ISA x86-64 | ISA AArch64 |
Architecture | Architecture Apple Silicon 15ARMv9.2-A |
Family | Family |
Branding  | Branding  |
Codename Strix Point - Zen 5P-Core - Zen 5cE-Core | Codename Sotra-C M5 ProVariant AS15PP-Core AS15MM-Core - |
Market Segment Laptop | Market Segment Laptop |
Release Date Jun 2, 2024 | Release Date Mar 3, 2026 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N4P | Fabrication Node N3P |
Die Size 233mm² | Die Size - |
Transistor Count 28 Billion | Transistor Count - |
Transistor Density 120 MTr/mm² | Transistor Density - |
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