Intel Core i3-L13G4 vs Intel Core i7-11370H Full Specs

Summary

5 Cores(1P+4E) 6 Threads(2P+4E) 800MHz	4 Cores 8 Threads 3.3GHz
TDP -	TDP 35W
Bandwidth 34.1GB/s LPDDR4X	Bandwidth 68.3GB/s LPDDR4X·DDR4
iGPU UHD 48EU 500MHz Gen 11	iGPU Iris Xe 96EU 1350MHz
Peak·FP32·FP16 768 GFLOPSFP16	Peak·FP32·FP16 4.15 TFLOPSFP16
Socket CSP 1016	Socket BGA 1449

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Core i3-L13G4646

x1

Core i7-11370H1,758

x2.72

Show Top Score

Core Config

5 Cores 1P 4E	4 Cores 4P -
6 Threads 2P 4E	8 Threads 8P -

Clocks

Base Clock 800MHz	Base Clock 3.3GHz
Boost Clock 2.8GHz	Boost Clock 4.8GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P 32KB E	L1i 32KB P -
L1d 48KB P 32KB E	L1d 48KB P -
L2 512KB P 1.5MB E shared	L2 1.25MB P -
L3 8MB	L3 12MB

Memory

Type LPDDR4X	Type LPDDR4X·DDR4
Max Memory 8GB	Max Memory 32GB
ECC No	ECC No
Channels 1	Channels 2
Bus Width 64-bit	Bus Width 128-bit
Speed 4266MT/s	Speed 4266MT/s
Bandwidth 34.1GB/s	Bandwidth 68.3GB/s
Bandwidth Calculator Channels Transfer Rate4266MT/s Calculated Bandwidth 34.1GB/s	Bandwidth Calculator Channels Transfer Rate4266MT/s Calculated Bandwidth 68.3GB/s

Power & Thermals

TDP -	TDP 35W
cTDP-down -	cTDP-down 28W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type OPI	Bus Type OPI
Bus Config 4 lanes	Bus Config 8 lanes
Bus Speed 4GT/s	Bus Speed 4GT/s
Bus Bandwidth 2GB/s	Bus Bandwidth 4GB/s

Expansion

PCIe PCIe 3.0 x6 5.9GB/sBandwidth

PCIe PCIe 4.0 x4 7.9GB/sBandwidth

iGPU

iGPU UHD 48EU 500MHz Gen 11	iGPU Iris Xe 96EU 1350MHz
Shaders 384	Shaders 768
Boost Clock 500MHz	Boost Clock 1.35GHz
Peak·FP32·FP16 768 GFLOPSFP16	Peak·FP32·FP16 4.15 TFLOPSFP16

NPU

NPU Model -

NPU Model GNA 2.0

Controller

Controller Model -	Controller Model 500 Series UP3+
Codename -	Codename Tiger Lake
PCIe -	PCIe -

Chip

Manufacturer Intel	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Lakefield	Architecture Tiger Lake
Family Core 11th Gen	Family Core 11th Gen
Branding	Branding
Codename Lakefield - Sunny CoveP-Core TremontE-Core	Codename Tiger Lake-H35 Tiger Lake-4C-GT3Variant Willow CoveP-Core -
Market Segment Laptop	Market Segment Laptop
Release Date May 28, 2020	Release Date Jan 11, 2021

Fabrication

Foundry Intel	Foundry Intel
Other Foundries IntelIO -	Other Foundries - IntelPCH
Fabrication Node 10nm+ 22nmIO -	Fabrication Node 10nm SuperFin - 14nmPCH
Die Size 82mm² 92mm²IO -	Die Size 146mm² - 55mm²PCH
Transistor Count 4 Billion 650 MillionIO	Transistor Count 9.5 Billion -
Transistor Density 49 MTr/mm² 7 MTr/mm²IO	Transistor Density 65 MTr/mm² -

Images

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Used In

Laptops Galaxy Book S(Mid 2020)	Laptops Surface Laptop Studio(Late 2021)Galaxy Book Odyssey(Early 2021)
All-in-Ones -	All-in-Ones Surface Studio 2+(Late 2022)

Competitors

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