Qualcomm Snapdragon X Plus (X1P-64-100) vs Intel Core i5-1135G7 Full Specs
10 Cores 10 Threads 3.4GHz | 4 Cores 8 Threads 1.4GHz |
TDP 23W | TDP 15W |
Bandwidth 135.2GB/s LPDDR5X | Bandwidth 59.7GB/s · |
iGPU | iGPU |
·· 7.68 TFLOPSFP16 | ·· 3.33 TFLOPSFP16 |
Socket - | Socket |
Snapdragon X Plus (X1P-64-100)2,349
Core i5-1135G71,67010 Cores | 4 Cores |
10 Threads | 8 Threads |
Base Clock 3.4GHz | Base Clock 1.4GHz |
Boost Clock - | Boost Clock 4.2GHz |
Overclocking Locked | Overclocking Locked |
L1i 192KB | L1i 32KB |
L1d 96KB | L1d 48KB |
L2 36MB shared | L2 1.25MB |
L3 - | L3 8MB |
SLC Cache 6MB | SLC Cache - |
Type LPDDR5X | Type · |
Max Memory 64GB | Max Memory 32GB |
ECC No | ECC No |
Channels 8 | Channels 2 |
Bus Width 128-bit | Bus Width 128-bit |
Speed 8448MT/s | Speed 3733MT/s |
Bandwidth 135.2GB/s | Bandwidth 59.7GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 135.2GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 59.7GB/s |
TDP 23W | TDP 15W |
cTDP-down - | cTDP-down 12W |
cTDP-up - | cTDP-up 28W |
Max Operating Temp - | Max Operating Temp 100°C Max |
Bus Type - | Bus Type OPI |
Bus Config - | Bus Config 8 lanes |
Bus Speed - | Bus Speed 4GT/s |
Bus Bandwidth - | Bus Bandwidth 4GB/s |
PCIe PCIe 4.0 x1223.6GB/sBandwidth | PCIe PCIe 4.0 x47.9GB/sBandwidth |
PCIe Secondary PCIe 3.0 x43.9GB/sBandwidth | - |
iGPU | iGPU |
Shaders 1536 | Shaders 640 |
Boost Clock 1.25GHz | Boost Clock 1.3GHz |
·· 7.68 TFLOPSFP16 | ·· 3.33 TFLOPSFP16 |
NPU Model Hexagon | NPU Model GNA 2.0 |
Performance 45 TOPSINT8 | Performance - |
Controller Model - | Controller Model 500 Series UP3+ |
Codename - | Codename Tiger Lake |
PCIe - | PCIe - |
Manufacturer | Manufacturer |
ISA AArch64 | ISA x86-64 |
Architecture OryonARMv8.7-A | Architecture |
Family | Family |
Branding  | Branding  |
Codename Hamoa Snapdragon X EliteVariant PhoenixP-Core | Codename Tiger Lake-H35 Tiger Lake-4C-GT3Variant Willow CoveP-Core |
Market Segment Laptop | Market Segment Laptop |
Release Date Apr 24, 2024 | Release Date Sep 2, 2020 |
Foundry TSMC | Foundry Intel |
Other Foundries - | Other Foundries IntelPCH |
Fabrication Node N4P - | Fabrication Node 10nm SuperFin 14nmPCH |
Die Size 170mm² - | Die Size 146mm² 55mm²PCH |
Transistor Count - | Transistor Count 9.5 Billion |
Transistor Density - | Transistor Density 65 MTr/mm² |
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