GPUs

AMD Radeon 760M 2600MHz vs Intel Graphics 4C 2300MHz Full Specs

384 Shaders
2.6GHz
512 Shaders
2.3GHz
Shared Memory120GB/s
·
Shared Memory136.5GB/s
·
··
2 TFLOPS
··
2.35 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Radeon 760M 2600MHzRadeon 760M 2600MHz3.99 TFLOPSFP16
x1
Graphics 4C 2300MHzGraphics 4C 2300MHz75.37 TOPSINT4 Tensor
x18.87

Clock Speed
···
Clock Speed
··
Peak OPS
3.99 TFLOPSFP16
Peak OPS
75.37 TOPSINT4 Tensor
-
Tensor FP16-32
18.84 TFLOPS
BF16
3.99 TFLOPS
Tensor BF16
-
BF16
-
Tensor BF16
18.84 TFLOPS
FP32
2 TFLOPS
FP32
2.35 TFLOPS
FP64
124.8 GFLOPS
FP64
588.8 GFLOPS
Tensor INT4
-
Tensor INT4
75.37 TOPS
-
Tensor INT8
37.68 TOPS
Pixel Rate
41.6 GPixel/s
Pixel Rate
36.8 GPixel/s
Texture Rate
62.4 GTexel/s
Texture Rate
73.6 GTexel/s

Shaders
384 Shaders
Shaders
512 Shaders
TMUs
24 TMUs
TMUs
32 TMUs
ROPs
16 ROPs
ROPs
16 ROPs
Tensor Cores
-
Tensor Cores
32 T-Cores
RT Cores
6 RT-Cores
RT Cores
4 RT-Cores
CUs
6 CUs
EUs
32 EUs

Base Clock
1.5GHz
Base Clock
-
Boost Clock
2.6GHz
Boost Clock
2.3GHz

L2 Cache
-
L2 Cache
4.1MB shared

Shared Memory
·
Shared Memory
·
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
7.5GT/s
Memory Speed
8.5GT/s
Memory Bandwidth
120GB/s
Memory Bandwidth
136.5GB/s

Multi-Monitor
4
Multi-Monitor
3
HDCP
HDCP 2.2
HDCP
-

Encoder Model
VCN 4.0
Encoder Model
Xe Media Engine

Decoder Model
VCN 4.0
Decoder Model
Xe Media Engine

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2023 branding
Branding
Graphics 2024 branding
Codename
Phoenix
Codename
Xe3 LPG
Chip Variant
-
Chip Variant
GT1
Market Segment
Laptop
Market Segment
Laptop
Release Date
May 3, 2023
Release Date
Jan 5, 2026

Foundry
TSMC
Foundry
Intel
Fabrication Node
N4
Fabrication Node
Intel 3
Die Size
178mm²
Die Size
27mm²
Transistor Count
25 Billion
Transistor Count
-
Transistor Density
140 MTr/mm²
Transistor Density
-

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