AMD Radeon 760M 2600MHz vs NVIDIA GeForce RTX 4050 Laptop 110W Full Specs
384 Shaders 2.6GHz | 2,560 Shaders 2.35GHz |
Shared Memory120GB/s · | 6GB GDDR6192GB/s placeholder |
·· 2 TFLOPS | ·· 12.06 TFLOPS |
Form Factor iGPU | Form Factor Soldered |
TDP Shared | TDP 110W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 3.99 TFLOPSFP16 | Peak OPS 385.8 TOPSINT4 Tensor Sparse |
- | Tensor FP8-16 96.46 TFLOPSFP8-16 Tensor Sparse 192.9 TFLOPSTensor FP8-32 48.23 TFLOPSFP8-32 Tensor Sparse 96.46 TFLOPS |
- | Tensor FP16-16 48.23 TFLOPSFP16-16 Tensor Sparse 96.46 TFLOPSTensor FP16-32 24.12 TFLOPSFP16-32 Tensor Sparse 48.23 TFLOPS |
BF16 3.99 TFLOPSTensor BF16 -BF16 Tensor Sparse - | BF16 12.06 TFLOPSTensor BF16 24.12 TFLOPSBF16 Tensor Sparse 48.23 TFLOPS |
Tensor TF32 - | Tensor TF32 12.06 TFLOPS |
FP32 2 TFLOPS | FP32 12.06 TFLOPS |
FP64 124.8 GFLOPS | FP64 188.4 GFLOPS |
Tensor INT4 - | Tensor INT4 192.9 TOPS |
- | Tensor INT8 96.46 TOPS |
Ray - | Ray 27.87 TOPS |
Pixel Rate 41.6 GPixel/s | Pixel Rate 75.4 GPixel/s |
Texture Rate 62.4 GTexel/s | Texture Rate 188.4 GTexel/s |
Shaders 384 Shaders | Shaders 2,560 Shaders |
TMUs 24 TMUs | TMUs 80 TMUs |
ROPs 16 ROPs | ROPs 32 ROPs |
Tensor Cores - | Tensor Cores 80 T-Cores |
RT Cores 6 RT-Cores | RT Cores 20 RT-Cores |
CUs 6 CUs | SMs 20 SMs |
Base Clock 1.5GHz | Base Clock 2.07GHz |
Boost Clock 2.6GHz | Boost Clock 2.35GHz |
L2 Cache - | L2 Cache 12.3MB shared |
Shared Memory · | 6GB GDDR6 placeholder |
Memory Bus 128-bit | Memory Bus 96-bit |
Memory Speed 7.5GT/s | Memory Speed 16GT/s |
Memory Bandwidth 120GB/s | Memory Bandwidth 192GB/s |
ECC No | ECC No |
TDP Shared | TDP 110W |
Multi-Monitor 4 | Multi-Monitor 4 |
HDCP HDCP 2.2 | HDCP HDCP 2.3 |
Encoder Model VCN 4.0 | Encoder Model NVENC 8 |
Decoder Model VCN 4.0 | Decoder Model NVDEC 5 |
Form Factor iGPU | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Phoenix | Codename NV187 |
Chip Variant - | Chip Variant AD107 |
Market Segment Laptop | Market Segment Laptop |
Release Date May 3, 2023 | Release Date Feb 22, 2023 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N4 | Fabrication Node 4N |
Die Size 178mm² | Die Size 159mm² |
Transistor Count 25 Billion | Transistor Count 18.9 Billion |
Transistor Density 140 MTr/mm² | Transistor Density 118.9 MTr/mm² |
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