GPUs

AMD Radeon 780M 2700MHz vs NVIDIA GeForce RTX 3050 Laptop 80W Full Specs

768 Shaders
2.7GHz
2,048 Shaders
1.74GHz
Shared Memory120GB/s
·
4GB GDDR6192GB/s
··
4.15 TFLOPS
··
7.13 TFLOPS
Form Factor
iGPU
Form Factor
Soldered
TDP
Shared
TDP
80W

Radeon 780M 2700MHzRadeon 780M 2700MHz8.29 TFLOPSFP16
x1
GeForce RTX 3050 Laptop 80WGeForce RTX 3050 Laptop 80W228.1 TOPSINT4 Tensor Sparse
x27.50

Clock Speed
···
Clock Speed
···
Peak OPS
8.29 TFLOPSFP16
Peak OPS
228.1 TOPSINT4 Tensor Sparse
-
Tensor FP16-16
28.51 TFLOPS
FP16-16 Tensor Sparse
57.02 TFLOPS
Tensor FP16-32
14.25 TFLOPS
FP16-32 Tensor Sparse
28.51 TFLOPS
BF16
8.29 TFLOPS
Tensor BF16
-
BF16 Tensor Sparse
-
BF16
7.13 TFLOPS
Tensor BF16
14.25 TFLOPS
BF16 Tensor Sparse
28.51 TFLOPS
Tensor TF32
-
Tensor TF32
7.13 TFLOPS
FP32
4.15 TFLOPS
FP32
7.13 TFLOPS
FP64
259.2 GFLOPS
FP64
111.4 GFLOPS
Tensor INT4
-
Tensor INT4
114 TOPS
-
Tensor INT8
57.02 TOPS
Ray
-
Ray
10.75 TOPS
Pixel Rate
86.4 GPixel/s
Pixel Rate
55.7 GPixel/s
Texture Rate
129.6 GTexel/s
Texture Rate
111.4 GTexel/s

Shaders
768 Shaders
Shaders
2,048 Shaders
TMUs
48 TMUs
TMUs
64 TMUs
ROPs
32 ROPs
ROPs
32 ROPs
Tensor Cores
-
Tensor Cores
64 T-Cores
RT Cores
12 RT-Cores
RT Cores
16 RT-Cores
CUs
12 CUs
SMs
16 SMs

Base Clock
1.5GHz
Base Clock
1.49GHz
Boost Clock
2.7GHz
Boost Clock
1.74GHz

L2 Cache
-
L2 Cache
2MB shared

Shared Memory
·
4GB GDDR6
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
7.5GT/s
Memory Speed
12GT/s
Memory Bandwidth
120GB/s
Memory Bandwidth
192GB/s

TDP
Shared
TDP
80W

Multi-Monitor
4
Multi-Monitor
3
HDCP
HDCP 2.2
HDCP
HDCP 2.3

Encoder Model
VCN 4.0
Encoder Model
NVENC 7

Decoder Model
VCN 4.0
Decoder Model
NVDEC 5

Form Factor
iGPU
Form Factor
Soldered

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2023 branding
Branding
GeForce RTX 2018 branding
Codename
Phoenix
Codename
NV177
Chip Variant
-
Chip Variant
GA107-140-A1
Market Segment
Laptop
Market Segment
Laptop
Release Date
May 5, 2023
Release Date
May 11, 2021

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N4
Fabrication Node
8N
Die Size
178mm²
Die Size
200mm²
Transistor Count
25 Billion
Transistor Count
8.7 Billion
Transistor Density
140 MTr/mm²
Transistor Density
43.5 MTr/mm²

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