GPUs

AMD Radeon 840M 2900MHz vs Intel Graphics 3C 2000MHz Full Specs

256 Shaders
2.9GHz
384 Shaders
2GHz
Shared Memory128GB/s
·
Shared Memory102.4GB/sDDR5
··
1.49 TFLOPS
··
1.54 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Radeon 840M 2900MHzRadeon 840M 2900MHz2.97 TFLOPSFP16
x1
Graphics 3C 2000MHzGraphics 3C 2000MHz3.07 TFLOPSFP16
x1.03

Clock Speed
···
Clock Speed
··
Peak OPS
2.97 TFLOPSFP16
Peak OPS
3.07 TFLOPSFP16
BF16
2.97 TFLOPS
-
FP32
1.49 TFLOPS
FP32
1.54 TFLOPS
FP64
92.8 GFLOPS
FP64
384 GFLOPS
Pixel Rate
92.8 GPixel/s
Pixel Rate
24 GPixel/s
Texture Rate
46.4 GTexel/s
Texture Rate
48 GTexel/s

Shaders
256 Shaders
Shaders
384 Shaders
TMUs
16 TMUs
TMUs
24 TMUs
ROPs
32 ROPs
ROPs
12 ROPs
RT Cores
4 RT-Cores
RT Cores
3 RT-Cores
CUs
4 CUs
EUs
48 EUs

Base Clock
1.5GHz
Base Clock
-
Boost Clock
2.9GHz
Boost Clock
2GHz

L2 Cache
-
L2 Cache
3.1MB shared

Shared Memory
·
Shared MemoryDDR5
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
8GT/s
Memory Speed
6.4GT/s
Memory Bandwidth
128GB/s
Memory Bandwidth
102.4GB/s

Multi-Monitor
4
Multi-Monitor
4
HDCP
HDCP 2.3
HDCP
-

Encoder Model
VCN 4.0
Encoder Model
Arc

Decoder Model
VCN 4.0
Decoder Model
Arc

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2023 branding
Branding
Graphics 2024 branding
Codename
Strix Point
Codename
Xe LPG
Chip Variant
-
Chip Variant
GT1
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jan 6, 2025
Release Date
Dec 14, 2023

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N4P
Fabrication Node
N5
Die Size
233mm²
Die Size
23mm²
Transistor Count
28 Billion
Transistor Count
-
Transistor Density
120 MTr/mm²
Transistor Density
-

No images available
No images available