GPUs

AMD Radeon 860M 3000MHz vs Intel Iris Pro 5200 1150MHz Full Specs

384 Shaders
3GHz
320 Shaders
1.15GHz
Shared Memory128GB/s
·
Shared Memory25.6GB/s
·
··
2.3 TFLOPS
··
736 GFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Radeon 860M 3000MHzRadeon 860M 3000MHz4.61 TFLOPSFP16
x6.26
Iris Pro 5200 1150MHzIris Pro 5200 1150MHz736 GFLOPSFP32
x1

Clock Speed
···
Clock Speed
···
Peak OPS
4.61 TFLOPSFP16
Peak OPS
736 GFLOPSFP32
BF16
4.61 TFLOPS
-
FP32
2.3 TFLOPS
FP32
736 GFLOPS
FP64
144 GFLOPS
FP64
184 GFLOPS
Pixel Rate
96 GPixel/s
Pixel Rate
4.6 GPixel/s
Texture Rate
72 GTexel/s
Texture Rate
46 GTexel/s

Shaders
384 Shaders
Shaders
320 Shaders
TMUs
24 TMUs
TMUs
40 TMUs
ROPs
32 ROPs
ROPs
4 ROPs
RT Cores
6 RT-Cores
RT Cores
-
CUs
6 CUs
EUs
40 EUs

Base Clock
1.5GHz
Base Clock
200MHz
Boost Clock
3GHz
Boost Clock
1.15GHz

Shared Memory
·
Shared Memory
·
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
8GT/s
Memory Speed
1.6GT/s
Memory Bandwidth
128GB/s
Memory Bandwidth
25.6GB/s
EDRAM
-
EDRAM
128MBSize
128BitBus Width
100GB/sBandwidth

Multi-Monitor
4
Multi-Monitor
2
HDCP
HDCP 2.3
HDCP
-

Encoder Model
VCN 4.0
Encoder Model
Quick Sync Video 3

Decoder Model
VCN 4.0
Decoder Model
Quick Sync Video 3

Form Factor
iGPU
Form Factor
iGPU
Cooling
Open-Air
Cooling
Passive

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2023 branding
Branding
Iris Pro 2013 branding
Codename
Strix Point
Codename
Haswell
Chip Variant
-
Chip Variant
GT1
Market Segment
Laptop
Market Segment
Desktop
Release Date
Jan 6, 2025
Release Date
May 27, 2013

Foundry
TSMC
Foundry
Intel
Fabrication Node
N4P
Fabrication Node
22nm
Die Size
233mm²
Die Size
260mm²
Transistor Count
28 Billion
Transistor Count
1.7 Billion
Transistor Density
120 MTr/mm²
Transistor Density
7 MTr/mm²

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