GPUs

AMD Radeon PRO W7400 vs ATI FireGL V8650 Full Specs

1,792 Shaders
1.1GHz
320 Shaders
688MHz
8GB GDDR6172.8GB/s
2GB GDDR4111.1GB/s
··
7.88 TFLOPS
··
440.3 GFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
55W
TDP
-
Power Connectors
-
Power Connectors
1x 8-Pin
1x 6-Pin

Radeon PRO W7400Radeon PRO W740031.54 TOPSINT4 Tensor
x71.63
FireGL V8650FireGL V8650440.3 GFLOPSFP32
x1

Clock Speed
···
Clock Speed
··
Peak OPS
31.54 TOPSINT4 Tensor
Peak OPS
440.3 GFLOPSFP32
Tensor FP16-16
7.88 TFLOPS
Tensor FP16-32
7.88 TFLOPS
-
BF16
15.77 TFLOPS
Tensor BF16
7.88 TFLOPS
-
FP32
7.88 TFLOPS
FP32
440.3 GFLOPS
FP64
246.4 GFLOPS
-
Tensor INT4
31.54 TOPS
Tensor INT4
-
Tensor INT8
7.88 TOPS
-
Pixel Rate
70.4 GPixel/s
Pixel Rate
11 GPixel/s
Texture Rate
123.2 GTexel/s
Texture Rate
11 GTexel/s

Shaders
1,792 Shaders
Shaders
320 Shaders
TMUs
112 TMUs
TMUs
16 TMUs
ROPs
64 ROPs
ROPs
16 ROPs
Tensor Cores
56 T-Cores
Tensor Cores
-
RT Cores
28 RT-Cores
RT Cores
-
CUs
28 CUs
CUs
4 CUs

Base Clock
1GHz
Base Clock
-
Boost Clock
1.1GHz
Boost Clock
688MHz

L2 Cache
2MB shared
L2 Cache
-
L3 Cache
32MB shared
L3 Cache
-
L3 Bandwidth
1.17TB/s
L3 Bandwidth
-

8GB GDDR6
2GB GDDR4
Memory Bus
128-bit
Memory Bus
512-bit
Memory Speed
10.8GT/s
Memory Speed
1.7GT/s
Memory Bandwidth
172.8GB/s
Memory Bandwidth
111.1GB/s
ECC
No
ECC
No

TDP
55W
TDP
-

Multi-Monitor
3
Multi-Monitor
2
HDCP
HDCP 2.3
HDCP
-

4x DisplayPort 2.1
-
-
2x DVI-I Dual-Link
-
1x S-Video

Encoder Model
VCN 4.0
-

Decoder Model
VCN 4.0
-

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
1-Slots
PCIe
2-Slots
Height
115 mm (4.53")
Width
216 mm (8.5")
Depth
20 mm (0.79")
Height
111 mm (4.37")
Width
254 mm (10")
Depth
37 mm (1.46")
Cooling
Blower
1x Fan
Cooling
Blower
1x Fan
Power Connectors
-
Power Connectors
1x 8-Pin, 1x 6-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon Pro 2023 branding
Branding
FireGL branding
Codename
Hotpink Bonefish
Codename
Pele
Chip Variant
Navi 33 XL
Chip Variant
R600 GT
Market Segment
Workstation
Market Segment
Workstation
Release Date
Aug 7, 2025
Release Date
Aug 6, 2007

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N6
Fabrication Node
80nm
Die Size
204mm²
Die Size
420mm²
Transistor Count
13.3 Billion
Transistor Count
720 Million
Transistor Density
65.2 MTr/mm²
Transistor Density
1.71 MTr/mm²

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