GPUs

AMD Radeon PRO W7600 vs ATI FireGL V7700 Full Specs

2,048 Shaders
2.44GHz
320 Shaders
775MHz
8GB GDDR6288GB/s
524MB GDDR472GB/s
··
19.99 TFLOPS
··
496 GFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
130W
TDP
-
Power Connectors
1x 8-Pin
-
Power Connectors
-
1x 6-Pin

Radeon PRO W7600Radeon PRO W760079.95 TOPSINT4 Tensor
x161.20
FireGL V7700FireGL V7700496 GFLOPSFP32
x1

Clock Speed
···
Clock Speed
··
Peak OPS
79.95 TOPSINT4 Tensor
Peak OPS
496 GFLOPSFP32
Tensor FP16-16
19.99 TFLOPS
Tensor FP16-32
19.99 TFLOPS
-
BF16
39.98 TFLOPS
Tensor BF16
19.99 TFLOPS
-
FP32
19.99 TFLOPS
FP32
496 GFLOPS
FP64
624.6 GFLOPS
-
Tensor INT4
79.95 TOPS
Tensor INT4
-
Tensor INT8
19.99 TOPS
-
Pixel Rate
156.2 GPixel/s
Pixel Rate
12.4 GPixel/s
Texture Rate
312.3 GTexel/s
Texture Rate
12.4 GTexel/s

Shaders
2,048 Shaders
Shaders
320 Shaders
TMUs
128 TMUs
TMUs
16 TMUs
ROPs
64 ROPs
ROPs
16 ROPs
Tensor Cores
64 T-Cores
Tensor Cores
-
RT Cores
32 RT-Cores
RT Cores
-
CUs
32 CUs
CUs
4 CUs

Base Clock
1.72GHz
Base Clock
-
Boost Clock
2.44GHz
Boost Clock
775MHz

L2 Cache
2MB shared
L2 Cache
256KB shared
L3 Cache
32MB shared
L3 Cache
-
L3 Bandwidth
1.17TB/s
L3 Bandwidth
-

8GB GDDR6
524MB GDDR4
Memory Bus
128-bit
Memory Bus
256-bit
Memory Speed
18GT/s
Memory Speed
2.3GT/s
Memory Bandwidth
288GB/s
Memory Bandwidth
72GB/s
ECC
No
ECC
No

TDP
130W
TDP
-

Multi-Monitor
3
Multi-Monitor
2
HDCP
HDCP 2.3
HDCP
-

4x DisplayPort 2.1
-
-
1x DisplayPort 1.0
-
1x DVI-I Dual-Link
-
1x S-Video

Encoder Model
VCN 4.0
-

Decoder Model
VCN 4.0
Decoder Model
UVD 1.0

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
1-Slots
PCIe
2-Slots
Height
115 mm (4.53")
Width
241 mm (9.49")
Depth
20 mm (0.79")
Height
111 mm (4.37")
Width
254 mm (10")
Depth
37 mm (1.46")
Cooling
Blower
1x Fan
Cooling
Blower
1x Fan
Power Connectors
1x 8-Pin
Power Connectors
1x 6-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon Pro 2023 branding
Branding
FireGL branding
Codename
Hotpink Bonefish
Codename
Boom
Chip Variant
Navi 33 XL
Chip Variant
R670 GL
Market Segment
Workstation
Market Segment
Workstation
Release Date
Aug 3, 2023
Release Date
Aug 6, 2007

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N6
Fabrication Node
80nm
Die Size
204mm²
Die Size
420mm²
Transistor Count
13.3 Billion
Transistor Count
720 Million
Transistor Density
65.2 MTr/mm²
Transistor Density
1.71 MTr/mm²

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