GPUs

AMD Radeon PRO W7700 vs ATI FireGL V8600 Full Specs

3,072 Shaders
2.6GHz
320 Shaders
688MHz
16GB GDDR6576GB/s
1GB GDDR4111.1GB/s
··
31.95 TFLOPS
··
440.3 GFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
190W
TDP
159W
Power Connectors
1x 8-Pin
-
Power Connectors
1x 8-Pin
1x 6-Pin

Radeon PRO W7700Radeon PRO W7700127.8 TOPSINT4 Tensor
x290.23
FireGL V8600FireGL V8600440.3 GFLOPSFP32
x1

Clock Speed
···
Clock Speed
··
Peak OPS
127.8 TOPSINT4 Tensor
Peak OPS
440.3 GFLOPSFP32
Tensor FP16-16
31.95 TFLOPS
Tensor FP16-32
31.95 TFLOPS
-
BF16
63.9 TFLOPS
Tensor BF16
31.95 TFLOPS
-
FP32
31.95 TFLOPS
FP32
440.3 GFLOPS
FP64
998.4 GFLOPS
-
Tensor INT4
127.8 TOPS
Tensor INT4
-
Tensor INT8
31.95 TOPS
-
Pixel Rate
249.6 GPixel/s
Pixel Rate
11 GPixel/s
Texture Rate
499.2 GTexel/s
Texture Rate
11 GTexel/s

Shaders
3,072 Shaders
Shaders
320 Shaders
TMUs
192 TMUs
TMUs
16 TMUs
ROPs
96 ROPs
ROPs
16 ROPs
Tensor Cores
96 T-Cores
Tensor Cores
-
RT Cores
48 RT-Cores
RT Cores
-
CUs
48 CUs
CUs
4 CUs

Base Clock
1.9GHz
Base Clock
-
Boost Clock
2.6GHz
Boost Clock
688MHz

L2 Cache
6.1MB shared
L2 Cache
-
L3 Cache
64MB shared
L3 Cache
-
L3 Bandwidth
2.33TB/s
L3 Bandwidth
-

16GB GDDR6
1GB GDDR4
Memory Bus
256-bit
Memory Bus
512-bit
Memory Speed
18GT/s
Memory Speed
1.7GT/s
Memory Bandwidth
576GB/s
Memory Bandwidth
111.1GB/s
ECC
No
ECC
No

TDP
190W
TDP
159W

Multi-Monitor
3
Multi-Monitor
2
HDCP
HDCP 2.3
HDCP
-

4x DisplayPort 2.1
-
-
2x DVI-I Dual-Link
-
1x S-Video

Encoder Model
VCN 4.0
-

Decoder Model
VCN 4.0
-

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
2-Slots
PCIe
2-Slots
Height
111 mm (4.37")
Width
241 mm (9.49")
Depth
40 mm (1.57")
Height
111 mm (4.37")
Width
254 mm (10")
Depth
37 mm (1.46")
Cooling
Blower
1x Fan
Cooling
Blower
1x Fan
Power Connectors
1x 8-Pin
Power Connectors
1x 8-Pin, 1x 6-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon Pro 2023 branding
Branding
FireGL branding
Codename
Wheat Nas
Codename
Pele
Chip Variant
Navi 32
Chip Variant
R600 GT
Market Segment
Workstation
Market Segment
Workstation
Release Date
Nov 13, 2023
Release Date
Aug 6, 2007

Foundry
TSMC
Foundry
TSMC
Other Foundries
TSMCMCD
Other Foundries
-
Fabrication Node
N5
N6MCD
Fabrication Node
80nm
-
Die Size
200mm²
150mm²MCD
Die Size
420mm²
-
Transistor Count
28.1 Billion
8.2 BillionMCD
Transistor Count
720 Million
-
Transistor Density
140.5 MTr/mm²
54.67 MTr/mm²MCD
Transistor Density
1.71 MTr/mm²
-

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