GPUs

AMD Radeon PRO W7900 vs ATI FireGL V8650 Full Specs

6,144 Shaders
2.5GHz
320 Shaders
688MHz
48GB GDDR6864GB/s
2GB GDDR4111.1GB/s
··
61.32 TFLOPS
··
440.3 GFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
295W
TDP
-
Power Connectors
2x 8-Pin
-
Power Connectors
1x 8-Pin
1x 6-Pin

Radeon PRO W7900Radeon PRO W7900245.3 TOPSINT4 Tensor
x557.02
FireGL V8650FireGL V8650440.3 GFLOPSFP32
x1

Clock Speed
··
Clock Speed
··
Peak OPS
245.3 TOPSINT4 Tensor
Peak OPS
440.3 GFLOPSFP32
Tensor FP16-16
61.32 TFLOPS
Tensor FP16-32
61.32 TFLOPS
-
BF16
122.6 TFLOPS
Tensor BF16
61.32 TFLOPS
-
FP32
61.32 TFLOPS
FP32
440.3 GFLOPS
FP64
1.92 TFLOPS
-
Tensor INT4
245.3 TOPS
Tensor INT4
-
Tensor INT8
61.32 TOPS
-
Pixel Rate
479 GPixel/s
Pixel Rate
11 GPixel/s
Texture Rate
958.1 GTexel/s
Texture Rate
11 GTexel/s

Shaders
6,144 Shaders
Shaders
320 Shaders
TMUs
384 TMUs
TMUs
16 TMUs
ROPs
192 ROPs
ROPs
16 ROPs
Tensor Cores
192 T-Cores
Tensor Cores
-
RT Cores
96 RT-Cores
RT Cores
-
CUs
96 CUs
CUs
4 CUs

Boost Clock
2.5GHz
Boost Clock
688MHz

L2 Cache
6.1MB shared
L2 Cache
-
L3 Cache
96MB shared
L3 Cache
-
L3 Bandwidth
3.5TB/s
L3 Bandwidth
-

48GB GDDR6
2GB GDDR4
Memory Bus
384-bit
Memory Bus
512-bit
Memory Speed
18GT/s
Memory Speed
1.7GT/s
Memory Bandwidth
864GB/s
Memory Bandwidth
111.1GB/s
ECC
No
ECC
No

TDP
295W
TDP
-

Multi-Monitor
3
Multi-Monitor
2
HDCP
HDCP 2.3
HDCP
-

3x DisplayPort 2.1
-
1x Mini DisplayPort 2.1
-
-
2x DVI-I Dual-Link
-
1x S-Video

Encoder Model
VCN 4.0
-

Decoder Model
VCN 4.0
-

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
3-Slots
PCIe
2-Slots
Height
110 mm (4.33")
Width
280 mm (11.02")
Depth
51 mm (2.01")
Height
111 mm (4.37")
Width
254 mm (10")
Depth
37 mm (1.46")
Cooling
Blower
1x Fan
Cooling
Blower
1x Fan
Power Connectors
2x 8-Pin
Power Connectors
1x 8-Pin, 1x 6-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon Pro 2023 branding
Branding
FireGL branding
Codename
Plum Bonito
Codename
Pele
Chip Variant
Navi 31 XL
Chip Variant
R600 GT
Market Segment
Workstation
Market Segment
Workstation
Release Date
Apr 13, 2023
Release Date
Aug 6, 2007

Foundry
TSMC
Foundry
TSMC
Other Foundries
TSMCMCD
Other Foundries
-
Fabrication Node
N5
N6MCD
Fabrication Node
80nm
-
Die Size
304mm²
225mm²MCD
Die Size
420mm²
-
Transistor Count
45.4 Billion
12.3 BillionMCD
Transistor Count
720 Million
-
Transistor Density
149.2 MTr/mm²
54.67 MTr/mm²MCD
Transistor Density
1.71 MTr/mm²
-

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