AMD Radeon R6 2CU 500MHz GCN 2 vs Imagination PowerVR GX6450 A8 Full Specs

Summary

128 Shaders 500MHz	128 Shaders 475MHz
Shared Memory10.7GB/sDDR3L	Shared Memory12.8GB/sLPDDR3
Peak·FP32·FP16 128 GFLOPS	Peak·FP32·FP16 121.6 GFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 FP64 Memory Bandwidth

Radeon R6 2CU 500MHz GCN 2128 GFLOPSFP32

x1

PowerVR GX6450 A8243.2 GFLOPSFP16

x1.90

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Theoretical Performance

Clock Speed500MHz UC·Boost·OC	Clock Speed475MHz UC·Boost·OC
Peak OPS 128 GFLOPSFP32	Peak OPS 243.2 GFLOPSFP16
FP32 128 GFLOPS	FP32 121.6 GFLOPS
FP64 8 GFLOPS	FP64 7.6 GFLOPS
Pixel Rate 2 GPixel/s	Pixel Rate 3.8 GPixel/s
Texture Rate 4 GTexel/s	Texture Rate 3.8 GTexel/s

Core Config

Shaders 128 Shaders	Shaders 128 Shaders
TMUs 8 TMUs	TMUs 8 TMUs
ROPs 4 ROPs	ROPs 8 ROPs
CUs 2 CUs	EUs 8 EUs

Clocks

Boost Clock 500MHz

Boost Clock 475MHz

Cache

L1 16KB/CU	L1 -
L2 Cache 64KB shared	L2 Cache -

Memory

Shared MemoryDDR3L	Shared MemoryLPDDR3
Memory Bus 64-bit	Memory Bus 64-bit
Memory Speed 1.3GT/s	Memory Speed 1.6GT/s
Memory Bandwidth 10.7GB/s	Memory Bandwidth 12.8GB/s
ECC No	ECC No

Video Output

Max Resolution 4096x2160	Max Resolution 2048x1536
Refresh Rate Calculator 3840x2160 Resolution4K UHD Refresh Rate 64Hz	Refresh Rate Calculator 1920x1080 Resolution1080p FHD Refresh Rate 91Hz
Multi-Monitor 3	Multi-Monitor 1
DSC Not Supported	DSC Not Supported

API Support

Shader Model 6.5	Shader Model -
DirectX DirectX 12 Direct3D 12_0	DirectX DirectX 10 Direct3D 10_0
OpenGL 4.6 OpenCL 2.1 Vulkan 1.2	OpenGL 3.3 OpenCL 1.2 Vulkan 1.1
GFX 7	-

Encoder

Encoder VCE 2.0	-
Codec AVC (H.264)	Codec -

Decoder

Decoder UVD 4.2	-
Codec MPEG-1 MPEG-2 MPEG-4 VC-1 AVC (H.264)	Codec -

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer AMD	Manufacturer Imagination
Chip Designer AMD	Chip Designer Imagination
Architecture GCN 2	Architecture Rogue
Family GCN 2	Family A Series
Branding	Branding
Codename Kalindi	Codename Series6XT
Chip Variant Kalindi LP	Chip Variant GXA6450
Market Segment Laptop	Market Segment Smartphone
Release Date Apr 29, 2014	Release Date Sep 19, 2014

Fabrication

Foundry GlobalFoundries	Foundry TSMC
Fabrication Node 28nm	Fabrication Node 20nm
Die Size 107mm²	Die Size 89mm²
Transistor Count 930M	Transistor Count 2B
Transistor Density 9 MTr/mm²	Transistor Density 22 MTr/mm²

Images

Used In

CPUs AMDA10 Micro-6700T4 Cores	CPUs AppleA82 CoresAppleA8 (iPad)2 Cores
Smartphones -	Smartphones AppleiPhone 6AppleiPhone 6 Plus
Tablets -	Tablets AppleiPad mini 4A8, Late 2015

Competitors

AMDRadeon R6 2CU 500MHz GCN 2 vs GPU AMDRadeon R5E 2CU 497MHz GCN 2 AMDRadeon R6 2CU 500MHz GCN 2 vs GPU AMDRadeon R2 2CU 400MHz GCN 2 AMDRadeon R6 2CU 500MHz GCN 2 vs GPU AMDRadeon R2 2CU 600MHz GCN 2 Show 12 more

ImaginationPowerVR GX6450 A8 vs GPU QualcommAdreno 608 ImaginationPowerVR GX6450 A8 vs GPU AMDRadeon R5E 2CU 497MHz GCN 2 ImaginationPowerVR GX6450 A8 vs AMDRadeon R6 2CU 500MHz GCN 2 Show 12 more