Imagination PowerVR GX6450 A8 vs AMD Radeon R5E 2CU 497MHz GCN 2 Full Specs

Summary

128 Shaders 475MHz	128 Shaders 497MHz
Shared Memory12.8GB/sLPDDR3	Shared Memory29.9GB/sDDR3
Peak·FP32·FP16 121.6 GFLOPS	Peak·FP32·FP16 127.2 GFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 FP64 Memory Bandwidth

PowerVR GX6450 A8243.2 GFLOPSFP16

x1.91

Radeon R5E 2CU 497MHz GCN 2127.2 GFLOPSFP32

x1

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Theoretical Performance

Clock Speed475MHz UC·Boost·OC	Clock Speed497MHz UC·Boost·OC
Peak OPS 243.2 GFLOPSFP16	Peak OPS 127.2 GFLOPSFP32
FP32 121.6 GFLOPS	FP32 127.2 GFLOPS
FP64 7.6 GFLOPS	FP64 7.95 GFLOPS
Pixel Rate 3.8 GPixel/s	Pixel Rate 2 GPixel/s
Texture Rate 3.8 GTexel/s	Texture Rate 4 GTexel/s

Core Config

Shaders 128 Shaders	Shaders 128 Shaders
TMUs 8 TMUs	TMUs 8 TMUs
ROPs 8 ROPs	ROPs 4 ROPs
EUs 8 EUs	CUs 2 CUs

Clocks

Boost Clock 475MHz

Boost Clock 497MHz

Cache

L1 -	L1 16KB/CU
L2 Cache -	L2 Cache 64KB shared

Memory

Shared MemoryLPDDR3	Shared MemoryDDR3
Memory Bus 64-bit	Memory Bus 128-bit
Memory Speed 1.6GT/s	Memory Speed 1.9GT/s
Memory Bandwidth 12.8GB/s	Memory Bandwidth 29.9GB/s
ECC No	ECC No

Video Output

Max Resolution 2048x1536	Max Resolution 4096x2160
Refresh Rate Calculator 1920x1080 Resolution1080p FHD Refresh Rate 91Hz	Refresh Rate Calculator 3840x2160 Resolution4K UHD Refresh Rate 64Hz
Multi-Monitor 1	Multi-Monitor 3
DSC Not Supported	DSC Not Supported

API Support

Shader Model -	Shader Model 6.5
DirectX DirectX 10 Direct3D 10_0	DirectX DirectX 12 Direct3D 12_0
OpenGL 3.3 OpenCL 1.2 Vulkan 1.1	OpenGL 4.6 OpenCL 2.1 Vulkan 1.2
-	GFX 7

Encoder

-	Encoder VCE 2.0
Codec -	Codec AVC (H.264)

Decoder

-	Decoder UVD 4.2
Codec -	Codec MPEG-1 MPEG-2 MPEG-4 VC-1 AVC (H.264)

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Imagination	Manufacturer AMD
Chip Designer Imagination	Chip Designer AMD
Architecture Rogue	Architecture GCN 2
Family A Series	Family GCN 2
Branding	Branding
Codename Series6XT	Codename Kalindi
Chip Variant GXA6450	Chip Variant Kalindi LP
Market Segment Smartphone	Market Segment Laptop
Release Date Sep 19, 2014	Release Date Jun 4, 2014

Fabrication

Foundry TSMC	Foundry GlobalFoundries
Fabrication Node 20nm	Fabrication Node 28nm
Die Size 89mm²	Die Size 107mm²
Transistor Count 2B	Transistor Count 930M
Transistor Density 22 MTr/mm²	Transistor Density 9 MTr/mm²

Images

Used In

CPUs AppleA82 CoresAppleA8 (iPad)2 Cores	CPUs AMDGX-424CC4 Cores
Smartphones AppleiPhone 6AppleiPhone 6 Plus	Smartphones -
Tablets AppleiPad mini 4A8, Late 2015	Tablets -

Competitors

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AMDRadeon R5E 2CU 497MHz GCN 2 vs GPU AMDRadeon R6 2CU 500MHz GCN 2 AMDRadeon R5E 2CU 497MHz GCN 2 vs GPU AMDRadeon R2 2CU 400MHz GCN 2 AMDRadeon R5E 2CU 497MHz GCN 2 vs GPU AMDRadeon R2 2CU 600MHz GCN 2 Show 12 more