GPUs

AMD Radeon R7 8CU 1108MHz GCN 3 vs Intel Graphics 4C 2000MHz Full Specs

512 Shaders
1.11GHz
512 Shaders
2GHz
Shared Memory38.4GB/sDDR4
Shared Memory134.4GB/s
·
··
1.14 TFLOPS
··
2.05 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Radeon R7 8CU 1108MHz GCN 3Radeon R7 8CU 1108MHz GCN 31.14 TFLOPSFP16
x1
Graphics 4C 2000MHzGraphics 4C 2000MHz4.1 TFLOPSFP16
x3.61

Clock Speed
··
Clock Speed
··
Peak OPS
1.14 TFLOPSFP16
Peak OPS
4.1 TFLOPSFP16
FP32
1.14 TFLOPS
FP32
2.05 TFLOPS
FP64
70.91 GFLOPS
FP64
512 GFLOPS
Pixel Rate
8.9 GPixel/s
Pixel Rate
32 GPixel/s
Texture Rate
35.5 GTexel/s
Texture Rate
64 GTexel/s

Shaders
512 Shaders
Shaders
512 Shaders
TMUs
32 TMUs
TMUs
32 TMUs
ROPs
8 ROPs
ROPs
16 ROPs
RT Cores
-
RT Cores
4 RT-Cores
CUs
8 CUs
EUs
64 EUs

Boost Clock
1.11GHz
Boost Clock
2GHz

L2 Cache
256KB shared
L2 Cache
4.1MB shared

Shared MemoryDDR4
Shared Memory
·
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
2.4GT/s
Memory Speed
8.4GT/s
Memory Bandwidth
38.4GB/s
Memory Bandwidth
134.4GB/s
ECC
No
ECC
No

Multi-Monitor
3
Multi-Monitor
4

Encoder Model
VCE 3.1
Encoder Model
Arc

Decoder Model
UVD 6.0
Decoder Model
Arc

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2016 branding
Branding
Graphics 2024 branding
Codename
Wani
Codename
Xe LPG
Chip Variant
-
Chip Variant
GT1
Market Segment
Laptop
Market Segment
Laptop
Release Date
Oct 1, 2016
Release Date
Dec 14, 2023

Foundry
GlobalFoundries
Foundry
TSMC
Fabrication Node
28nm
Fabrication Node
N5
Die Size
250mm²
Die Size
23mm²
Transistor Count
3.1 Billion
Transistor Count
-
Transistor Density
12 MTr/mm²
Transistor Density
-

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